A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

A polyphenylene ether bismaleimide resin, a method for manufacturing the same, and a resin composition are provided. The polyphenylene ether bismaleimide (PPE-BMI) resin is obtained by a condensation reaction with a maleic anhydride and a primary amine compound as reactants. The primary amine compound is a polyphenylene ether diamine.

A polyphenylene ether bismaleimide resin, a method for manufacturing the same, and a resin composition are provided. The polyphenylene ether bismaleimide (PPE-BMI) resin is obtained by a condensation reaction with a maleic anhydride and a primary amine compound as reactants. The primary amine compound is a polyphenylene ether diamine.

A resin composition, including resin and peroxide, is provided. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. The sum of the liquid rubber resin, the polyphenylene ether resin, and the crosslinking agent is 100 parts by mass. The amount of the peroxide used is between 0.1 phr and 5 phr. The peroxide is composed of tertiary butyl cumyl peroxide and an inorganic compound.

A resin composition, including resin and peroxide, is provided. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. The sum of the liquid rubber resin, the polyphenylene ether resin, and the crosslinking agent is 100 parts by mass. The amount of the peroxide used is between 0.1 phr and 5 phr. The peroxide is composed of tertiary butyl cumyl peroxide and an inorganic compound.

A phosphorus-containing silane compound has a structure of SiR.sub.1(R.sub.2).sub.n(R.sub.3).sub.3-n, wherein R.sub.1 is a phenyl group, R.sub.2 is a vinyl group, R.sub.3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.

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A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are dispersed in the resin composition. The resin composition includes 10 wt % to 40 wt % of a liquid rubber, 20 wt % to 50 wt % of a polyphenylene ether resin, and 10 wt % to 30 wt % of a crosslinker. The polyphenylene ether resin includes a first polyphenylene ether that has a bismaleimide group at a molecular end.

A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are dispersed in the resin composition. The resin composition includes 10 wt % to 40 wt % of a liquid rubber, 20 wt % to 50 wt % of a polyphenylene ether resin, and 10 wt % to 30 wt % of a crosslinker. The polyphenylene ether resin includes a first polyphenylene ether that has a bismaleimide group at a molecular end.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.