Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.

A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (B) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (C) being an organic peroxide containing no benzene ring. The component (C) is contained with a proportion of 0.1% to 7% by mass relative to 100% by mass of the total mass of the components (A), (B), and (C).

A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (B) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (C) being an organic peroxide containing no benzene ring. The component (C) is contained with a proportion of 0.1% to 7% by mass relative to 100% by mass of the total mass of the components (A), (B), and (C).

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

A poly(arylene ether) copolymer wherein the poly(arylene ether) copolymer is a product of oxidative copolymerization of monomers comprising a first monohydric phenol; a second monohydric phenol different from the first monohydric phenol; a multifunctional phenol or polyphenol comprising a novolac, a dicyclopentadiene phenol novolac, or a combination thereof, and optionally, a trisphenol, wherein the functionality of the multifunctional phenol or polyphenol is greater than 2; and optionally, at least one terminal functional group.

A rubber composition is based on at least one predominant vinylaromatic diene elastomer, a reinforcing filler, a crosslinking system and a thermoplastic resin comprising optionally substituted polyphenylene ether units, said resin having a compatibility with said vinylaromatic diene elastomer such that a mixture of said vinylaromatic diene elastomer and said resin creates a composition having less than 10% of its volume in the form of particles greater than 2 micrometres in size. The rubber composition may be used in semi-finished tire articles and tires.

Provided is a molded article in which the formation of depressions in a vapor deposited aluminum surface of the molded article caused by long-term exposure to high-temperature conditions is suppressed such that the vapor deposited aluminum surface has excellent external appearance that has not conventionally been achieved. A light reflective part includes a polyphenylene ether resin composition containing a polyphenylene ether (A) and at least one compound (B) selected from the group consisting of: an organophosphorus compound having a chemical structure in formula (I) or (II), shown below, in molecules thereof; phosphonic acids, phosphonic acid esters, phosphinic acids, and phosphinic acid esters other than the organophosphorus compound; monocarboxylic acids; sulfonic acids; and sulfinic acids. The (A) component has a content of from 95 mass % to 99.95 mass % and the (B) component has a content of from 0.05 mass % to 5 mass % relative to 100 mass %, in total, of the (A) component and the (B) component. ##STR00001##

Provided is a molded article in which the formation of depressions in a vapor deposited aluminum surface of the molded article caused by long-term exposure to high-temperature conditions is suppressed such that the vapor deposited aluminum surface has excellent external appearance that has not conventionally been achieved. A light reflective part includes a polyphenylene ether resin composition containing a polyphenylene ether (A) and at least one compound (B) selected from the group consisting of: an organophosphorus compound having a chemical structure in formula (I) or (II), shown below, in molecules thereof; phosphonic acids, phosphonic acid esters, phosphinic acids, and phosphinic acid esters other than the organophosphorus compound; monocarboxylic acids; sulfonic acids; and sulfinic acids. The (A) component has a content of from 95 mass % to 99.95 mass % and the (B) component has a content of from 0.05 mass % to 5 mass % relative to 100 mass %, in total, of the (A) component and the (B) component. ##STR00001##

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.