A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

Provided is a resin composition containing a resin (S) containing a polyarylene ether (A) modified with a functional group and a thermoplastic resin (B), and a carbon fiber (C).

Provided is a resin composition containing a resin (S) containing a polyarylene ether (A) modified with a functional group and a thermoplastic resin (B), and a carbon fiber (C).

A hydrogenated block copolymer is disclosed comprising a polymer block A and a polymer block B. Prior to hydrogenation, the polymer block A has a first vinyl aromatic compound, and the polymer block B contains monomers a) a styrene compound having a radical reactive group and b) at least one conjugated diene, and optionally (c) a second vinyl aromatic compound that is same or different from the first vinyl aromatic compound. The repeat units of monomer a) forms 10-80 wt. % of the total block copolymer, and 10-70 wt. % of the total weight of block B. After hydrogenation, the polymerized units derived from the monomer b) has a RU of 0-1.5 meq per gram of the hydrogenated block copolymer. The hydrogenated block copolymer exhibits reactivity and higher flow properties before curing, after curing, shows excellent mechanical properties, improved flame resistance, and good solvent resistance.

A hydrogenated block copolymer is disclosed comprising a polymer block A and a polymer block B. Prior to hydrogenation, the polymer block A has a first vinyl aromatic compound, and the polymer block B contains monomers a) a styrene compound having a radical reactive group and b) at least one conjugated diene, and optionally (c) a second vinyl aromatic compound that is same or different from the first vinyl aromatic compound. The repeat units of monomer a) forms 10-80 wt. % of the total block copolymer, and 10-70 wt. % of the total weight of block B. After hydrogenation, the polymerized units derived from the monomer b) has a RU of 0-1.5 meq per gram of the hydrogenated block copolymer. The hydrogenated block copolymer exhibits reactivity and higher flow properties before curing, after curing, shows excellent mechanical properties, improved flame resistance, and good solvent resistance.

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

##STR00001##

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The resin composition is for use in a printed wiring board for high multilayer and high frequency, and is excellent in moldability, electric characteristics, peel strength, flame resistance and heat resistance after moisture absorption. Further, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e). The resin composition is for use in a printed wiring board for high multilayer and high frequency, and is excellent in moldability, electric characteristics, peel strength, flame resistance and heat resistance after moisture absorption. Further, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

Moisture-crosslinkable compositions having an alkoxysilane functionalized ethylenic polymer, a polymeric brominated flame retardant, antimony trioxide, and a silanol condensation catalyst. The polymeric brominated flame retardant and the antimony trioxide are present in quantities sufficient to provide a molar ratio of antimony to bromine (Sb/Br) in the range of from 0.79 to 1.70. Additionally, the polymeric brominated flame retardant and the antimony trioxide are present in the composition in a combined amount of greater than 35 wt %. Such moisture-crosslinkable compositions are suitable for use in preparing crosslinked articles of manufacture, such as for wire-and-cable applications.

Moisture-crosslinkable compositions having an alkoxysilane functionalized ethylenic polymer, a polymeric brominated flame retardant, antimony trioxide, and a silanol condensation catalyst. The polymeric brominated flame retardant and the antimony trioxide are present in quantities sufficient to provide a molar ratio of antimony to bromine (Sb/Br) in the range of from 0.79 to 1.70. Additionally, the polymeric brominated flame retardant and the antimony trioxide are present in the composition in a combined amount of greater than 35 wt %. Such moisture-crosslinkable compositions are suitable for use in preparing crosslinked articles of manufacture, such as for wire-and-cable applications.