The resin composition for encapsulating semiconductor of the present invention is a resin composition for encapsulating semiconductor including an epoxy resin, a curing agent, an inorganic filler, and carbon black fine particles, in which when the resin composition for encapsulating semiconductor is injection-molded to have a length of 80 mm, a width of 10 mm and a thickness of 4 mm under conditions of a mold temperature of 175° C., an injection pressure of 10 MPa, and a curing time of 120 seconds, and then heated at 175° C. for 4 hours to obtain a cured product, and then a surface of the obtained cured product is observed with a fluorescence microscope, a maximum particle diameter of aggregates of the carbon black fine particles is 50 μm or less.

The following invention generally relates to a melt flowable biocarbon polymeric material derived from a cellulosic ethanol refining co-product, monolignol biopolymer, and a heat processed or thermally modified biomass flour, both of which are reacted together to create a melt flowable biopolymer which has melt flowable properties, process-ability and rheology similar to that of standard petrochemical based thermoplastics.

The following invention generally relates to a melt flowable biocarbon polymeric material derived from a cellulosic ethanol refining co-product, monolignol biopolymer, and a heat processed or thermally modified biomass flour, both of which are reacted together to create a melt flowable biopolymer which has melt flowable properties, process-ability and rheology similar to that of standard petrochemical based thermoplastics.

The present invention relates to a method for oxidizing a carbon black which can prevent or alleviate change in the surface oxidation degree of the carbon black by a residual ozone after surface oxidation reforming, and a method for preparing the carbon black by comprising it in a single continuous process.

The resin composition for encapsulating semiconductor of the present invention is a resin composition for encapsulating semiconductor including an epoxy resin, a curing agent, an inorganic filler, and carbon black fine particles, in which when the resin composition for encapsulating semiconductor is injection-molded to have a length of 80 mm, a width of 10 mm and a thickness of 4 mm under conditions of a mold temperature of 175 C., an injection pressure of 10 MPa, and a curing time of 120 seconds, and then heated at 175 C. for 4 hours to obtain a cured product, and then a surface of the obtained cured product is observed with a fluorescence microscope, a maximum particle diameter of aggregates of the carbon black fine particles is 50 m or less.

The disclosed method and related systems and devices relate to producing a pigment from microbial biomass. The pigment may be an engineered black pigment. The method may include a thermal processing step where the microbial biomass is charred. The biomass in the charred and pre-charred state can be washed chemically and/or mechanically. In another step the biomass is ground via a grinding of milling process. The grinding/milling may occur at any various points in the process. In some embodiments the biomass has a particle size between 0.01 and 100 microns.

The disclosed method and related systems and devices relate to producing a pigment from microbial biomass. The pigment may be an engineered black pigment. The method may include a thermal processing step where the microbial biomass is charred. The biomass in the charred and pre-charred state can be washed chemically and/or mechanically. In another step the biomass is ground via a grinding of milling process. The grinding/milling may occur at any various points in the process. In some embodiments the biomass has a particle size between 0.01 and 100 microns.

Provided herein is a method of forming a composition by co-processing nanocarbon aggregates and carbon black aggregates, which includes providing nanocarbon aggregates, providing carbon black aggregates, and mixing the nanocarbon aggregates and the carbon black aggregates such that the nanocarbon aggregates disperse into looser aggregates of nanocarbons and carbon black, or individualized nanocarbons dispersed among the carbon black aggregates.

Provided herein is a method of forming a composition by co-processing nanocarbon aggregates and carbon black aggregates, which includes providing nanocarbon aggregates, providing carbon black aggregates, and mixing the nanocarbon aggregates and the carbon black aggregates such that the nanocarbon aggregates disperse into looser aggregates of nanocarbons and carbon black, or individualized nanocarbons dispersed among the carbon black aggregates.

The present invention generally relates to a method for preparing a carbon black of high resistivity through the surface treatment of the carbon black which exhibits conductivity, and a carbon black prepared by this method.