A radiation curable inkjet ink including an adhesion promoter including (1) at least one a free radical polymerizable group selected from the group consisting of an acrylate, a methacrylate, an acryl amide and a methacryl amide; (2) at least one aliphatic tertiary amine; and (3) at least one carboxylic acid or salt thereof with the proviso that the carboxylic acid is linked to an aliphatic tertiary amine via a divalent linking group selected from the group consisting of an optionally substituted methylene group and an optionally substituted ethylene group.

The present invention is a thermal inkjet ink that provides good reliability at a wide range of industrial print conditions from both low temperature to high temperature environments across a broad range of humidities. It is particularly advantageous in low-temperature applications, for example, printing at temperatures down to 5° C. or lower continuously for 8 hours without developing print defects which can lead to unreadable codes; and, in the meantime also maintains other critical functional aspects including contrast, wetting, decap time, dry time, adhesion, ink cartridge stability, etc. The inks contain one or more binder resins that exhibit a hydroxyl number or acid number of at least 100 mg KOH/g; one or more terpene phenolic resins; one or more volatile organic solvents; and one or more dyes, and optionally further components.

The present disclosure is directed to a composition including a polyvinyl butyral represented by the following formula:

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wherein A, B and C represent a proportion of corresponding repeat units expressed as a weight percent, wherein each repeat unit is randomly distributed along a polymer chain and wherein the sum of A, B and C is about 100 weight percent; a poly(melamine-co-formaldehyde) based polymer and an anhydride. Devices coated with the composition and cured films formed from the composition comprising conductive features are also provided.

The present application provides a sublimation ink which is capable of being transferred to natural fiber fabrics, such as cotton and linen, in addition to synthetic fabrics, such as polyester, nylon, etc., and shows significantly improved color fastness. The sublimation ink may include a resin containing at least one active hydrogen, a crosslinking agent having at least two isocyanate (—NCO) groups, and one or more colorants. The sublimation ink may also include one or more carriers, binders, thickeners, and/or solvents. An image can be printed on a transfer medium (e.g. paper) at room temperature with the sublimation ink using conventional offset printer so that the sublimation ink remains inactive. The image can be subsequently transferred onto any desired fabrics under heat and pressure, in which the sublimation ink is activated and bonds the colorant to the fabrics with excellent color effect.

The present application provides a sublimation ink which is capable of being transferred to natural fiber fabrics, such as cotton and linen, in addition to synthetic fabrics, such as polyester, nylon, etc., and shows significantly improved color fastness. The sublimation ink may include a resin containing at least one active hydrogen, a crosslinking agent having at least two isocyanate (—NCO) groups, and one or more colorants. The sublimation ink may also include one or more carriers, binders, thickeners, and/or solvents. An image can be printed on a transfer medium (e.g. paper) at room temperature with the sublimation ink using conventional offset printer so that the sublimation ink remains inactive. The image can be subsequently transferred onto any desired fabrics under heat and pressure, in which the sublimation ink is activated and bonds the colorant to the fabrics with excellent color effect.

The present disclosure is drawn to non-aqueous ink compositions. The non-aqueous ink compositions can include from 70 wt % to 98 wt % alcohol solvent, from 1 wt % to 6 wt % phenol-formaldehyde resin, from 1 wt % to 5 wt % tackifier, and from 1 wt % to 14 wt % organic solvent-soluble dye. The tackifier can include a shellac having an acid number from 50 KOH/g to 100 mg KOH/g or a tackifier resin having an acid number from 100 mg KOH/g to 300 mg KOH/g.

The present disclosure is drawn to non-aqueous ink compositions. The non-aqueous ink compositions can include from 70 wt % to 98 wt % alcohol solvent, from 1 wt % to 6 wt % phenol-formaldehyde resin, from 1 wt % to 5 wt % tackifier, and from 1 wt % to 14 wt % organic solvent-soluble dye. The tackifier can include a shellac having an acid number from 50 KOH/g to 100 mg KOH/g or a tackifier resin having an acid number from 100 mg KOH/g to 300 mg KOH/g.

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.

A rosin-modified phenol resin (A) is a reaction product of a rosin (b), a phenol (c), a formaldehyde (d) and a polyol (e), wherein the rosin (b) contains 0.1 to 3.5% by mass of a monoterpene (a1) and a sesquiterpene (a2) relative to the total weight of the rosin, and Mw/Mn which is the ratio of the weight average molecular weight (Mw) and the number average molecular weight (Mn) is 10 to 60.