Provided herein are polyesters that comprise (i) monomer units derived from sugar-based bicyclic diol; (ii) monomer units derived from an unsaturated aliphatic diacid; and (iii) monomer units derived from a saturated aliphatic diacid. The monomer units derived from the ethylenically unsaturated aliphatic diacid can be present in an amount of from greater than 0 mole % to 40 mole % of the polyester. These polyesters can be formed into articles using additive manufacturing methods. The resulting articles can be biocompatible, resorbable over a span of from 3 months to 12 months following implantation in the human body, and can exhibit desirable mechanical properties for applications, including porosity and elasticity.

Provided herein are polyesters that comprise (i) monomer units derived from sugar-based bicyclic diol; (ii) monomer units derived from an unsaturated aliphatic diacid; and (iii) monomer units derived from a saturated aliphatic diacid. The monomer units derived from the ethylenically unsaturated aliphatic diacid can be present in an amount of from greater than 0 mole % to 40 mole % of the polyester. These polyesters can be formed into articles using additive manufacturing methods. The resulting articles can be biocompatible, resorbable over a span of from 3 months to 12 months following implantation in the human body, and can exhibit desirable mechanical properties for applications, including porosity and elasticity.

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

An aqueous ink jet ink composition contains an organic solvent with an SP value of 9.5 to 10.5, resin particles, a plasticizer, and water. With respect to the amount of the aqueous ink jet ink composition, 1.0% by mass to 10.0% by mass of the organic solvent is contained.

An aqueous ink jet ink composition contains an organic solvent with an SP value of 9.5 to 10.5, resin particles, a plasticizer, and water. With respect to the amount of the aqueous ink jet ink composition, 1.0% by mass to 10.0% by mass of the organic solvent is contained.

An ink jet method includes a step of adhering ink jet compositions containing colorants and polymerizable compounds to be cured with radioactive rays to a recording medium by one printing operation, and the ink jet compositions includes an orange ink composition and a red ink composition.

An ink jet method includes a step of adhering ink jet compositions containing colorants and polymerizable compounds to be cured with radioactive rays to a recording medium by one printing operation, and the ink jet compositions includes an orange ink composition and a red ink composition.

In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprises 20-60 wt. % oligomeric curable material; 10-50 wt. % cyclocarbonate (meth)acrylate monomer; and 0.1-5 wt. % photoinitiator, based on the total weight of the ink. Additionally, in some cases, the ink further comprises one or more additional curable materials differing from the oligomeric curable material and the cyclocarbonate (meth)acrylate monomer. An ink described herein, in some embodiments, also comprises one or more additional component that are non-curable.

In one aspect, inks for use with a three-dimensional (3D) printing system are described herein. In some embodiments, an ink described herein comprises 20-60 wt. % oligomeric curable material; 10-50 wt. % cyclocarbonate (meth)acrylate monomer; and 0.1-5 wt. % photoinitiator, based on the total weight of the ink. Additionally, in some cases, the ink further comprises one or more additional curable materials differing from the oligomeric curable material and the cyclocarbonate (meth)acrylate monomer. An ink described herein, in some embodiments, also comprises one or more additional component that are non-curable.