C09D11/108

Water-based inkjet ink and production method for printed matter

One embodiment relates to a water-based inkjet ink containing at least water, a pigment, a water-soluble organic solvent and a binder resin, wherein the water-soluble organic solvent contains at least a water-soluble organic solvent having a surface tension of 30 to 50 mN/m and a boiling point at 1 atmosphere of 180 to 230° C., in an amount of 15 to 50% by weight relative to the total weight of the water-based inkjet ink, and the acid value of the binder resin is at least 5 mgKOH/g but less than 60 mgKOH/g.

AQUEOUS INKJET INK COMPOSITIONS MADE FROM MONODISPERSE LATEXES

Aqueous inkjet ink compositions are provided. In an embodiment, such a composition comprises water; a monodisperse latex; and a colorant; wherein the monodisperse latex comprises resin particles comprising a polymerization product of a monomer, an acidic monomer, a multifunctional monomer, and a reactive surfactant, the resin particles having a D.sub.(z, ave) of no greater than 150 nm, a D.sub.(z, 90) of less than 200 nm, and a polydispersity index (PDI) of no greater than 0.050. Methods of forming and using the aqueous inkjet ink compositions are also provided.

AQUEOUS INKJET INK COMPOSITIONS MADE FROM MONODISPERSE LATEXES

Aqueous inkjet ink compositions are provided. In an embodiment, such a composition comprises water; a monodisperse latex; and a colorant; wherein the monodisperse latex comprises resin particles comprising a polymerization product of a monomer, an acidic monomer, a multifunctional monomer, and a reactive surfactant, the resin particles having a D.sub.(z, ave) of no greater than 150 nm, a D.sub.(z, 90) of less than 200 nm, and a polydispersity index (PDI) of no greater than 0.050. Methods of forming and using the aqueous inkjet ink compositions are also provided.

Polymer emulsion as binder for conductive composition

Provided herein are metal conductive compositions with improved conductivity. The improved conductivity is attributable to the addition of a sintering agent and a polymer emulsion.

Polymer emulsion as binder for conductive composition

Provided herein are metal conductive compositions with improved conductivity. The improved conductivity is attributable to the addition of a sintering agent and a polymer emulsion.

Precipitation of polyether block amide and thermoplastic polyethylene to enhance operational window for three dimensional printing
11739230 · 2023-08-29 · ·

A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

Precipitation of polyether block amide and thermoplastic polyethylene to enhance operational window for three dimensional printing
11739230 · 2023-08-29 · ·

A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

Conductive paste composition

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Conductive paste composition

A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

DIGITALLY PRINTED LABELS

Described are primer coatings, overprint varnishes, and seaming solution solutions for application to substrates such as those used to make wrap around and sleeve labels, particularly shrink wrap labels, which are used to label containers. The labels can be digitally printed with or without lane priming. With certain seaming solutions, the labels can be removed in the wash stage to enable the recycling of containers.