A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

A single coated conductor for an overhead power transmission or distribution line is provided comprising one or more electrical conductors (400) and a first coating (401) provided on at least a portion of the one or more electrical conductors (400). The first coating (401) comprises: (i) an inorganic binder comprising an alkali metal silicate; (ii) a polymerisation agent comprising nanosilica (“nS”) or colloidal silica (SiO.sub.2); and (iii) a photocatalytic agent, wherein the photocatalytic agent comprises ≥70 wt % anatase titanium dioxide (TiO.sub.2) having an average particle size (“aps”) ≤100 nm. The first coating (401) has an average thermal emissivity coefficient E≥0.90 across the infrared spectrum 2.5-30.0 μm and has an average solar reflectivity coefficient R≥0.90 and/or an average solar absorptivity coefficient A≤0.10 across the solar spectrum 0.3-2.5 μm.

This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.

A novel biodegradable material for use in packaging applications, including food packaging applications, is provided. The disclosed biodegradable material is simple and cost efficient to manufacture, provides a superior water vapor barrier and/or oxygen barrier that is superior to prior art biodegradable and/or compostable materials used in packaging applications, and can withstand exposure to a wide variety of physical and chemical environments.

Granules of material usable as a road binder or as a sealing binder including a core and a coating layer, wherein: the core consists of a first composition including at least one material selected from: a bitumen base, a pitch, a clear binder, and the coating layer consists of a second composition which includes: at least one viscosifying compound selected from cellulose ethers, and at least one anticaking agent. Also, a method for producing granules of material that can be used as a road binder or as a sealing binder, and the use thereof as a road binder, in particular for the production of coated materials. Also, a method for producing coatings from granules of material that can be used as a road binder or as a sealing binder and to a method for transporting and/or storing and/or handling granules.

The present disclosure relates to support structures for three dimensional (3D) printing, methods of preparing the support structures, and methods of using the support structures. In particular, the support structures comprise a hydrogel comprised of a cellulose derivative. Preferably, the support structures are biodegradable and easily removed without generating toxic waste.

A method for producing a coating liquid includes a stirring step of stirring a raw material containing porous particles, a binder resin, and a liquid medium using a planetary mixer. A coating liquid contains porous particles, a binder resin, and a liquid medium, wherein a content of the porous particles is 20% by mass or more. A coating film contains porous particles and a binder resin, wherein a content of the porous particles is 80% by mass or more, and the coating film has a density of 0.4 g/cm.sup.3 or less.

A method for producing a coating liquid includes a stirring step of stirring a raw material containing porous particles, a binder resin, and a liquid medium using a planetary mixer. A coating liquid contains porous particles, a binder resin, and a liquid medium, wherein a content of the porous particles is 20% by mass or more. A coating film contains porous particles and a binder resin, wherein a content of the porous particles is 80% by mass or more, and the coating film has a density of 0.4 g/cm.sup.3 or less.

A single coated conductor for an overhead power transmission or distribution line is provided comprising one or more electrical conductors (400) and a first coating (401) provided on at least a portion of the one or more electrical conductors (400). The first coating (401) comprises: (i) an inorganic binder comprising an alkali metal silicate; (ii) a polymerisation agent comprising nanosilica (“nS”) or colloidal silica (SiO.sub.2); and (iii) a photocatalytic agent, wherein the photocatalytic agent comprises ≥70 wt % anatase titanium dioxide (TiO.sub.2) having an average particle size (“aps”)≤100 nm. The first coating (401) has an average thermal emissivity coefficient E≥0.90 across the infrared spectrum 2.5-30.0 μm and has an average solar reflectivity coefficient R≥0.90 and/or an average solar absorptivity coefficient A≤0.10 across the solar spectrum 0.3-2.5 μm.

A printed wiring board includes a substrate and wiring provided on a surface of the substrate and including a cured conductive paste. The conductive paste contains metal nanoparticles having an average particle diameter of 30 nm or more and 600 nm or less, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. The wiring has a length of 100 mm or more and 1600 mm or less, a width of 0.3 mm or more and 3 mm or less, a thickness of 10 μm or more and 40 μm or less, and a resistance value of 1000 mΩ/m or less.