A solvent-free undercoat composition for corrosion control at welds and other repair sites on plastic-sheathed steel pipes with and without cathodic protection, including a component K1: a water-based rubber dispersion for formation of a barrier layer for isolating the metallic repair site from oxygen, water vapor and water penetrating from externally; a component K2: a water-based resin dispersion for adhesion on the metallic surface of the repair site and on the nonpolar surfaces of the plastic sheathing; a component K3: an aqueous emulsion of prehydrolyzed organofunctional silanes for accelerating the drying, for improving the adhesion to the metallic surface, particularly at elevated temperatures, and for increasing the resistance to cathodic disbondment.

A solvent-free undercoat composition for corrosion control at welds and other repair sites on plastic-sheathed steel pipes with and without cathodic protection, including a component K1: a water-based rubber dispersion for formation of a barrier layer for isolating the metallic repair site from oxygen, water vapor and water penetrating from externally; a component K2: a water-based resin dispersion for adhesion on the metallic surface of the repair site and on the nonpolar surfaces of the plastic sheathing; a component K3: an aqueous emulsion of prehydrolyzed organofunctional silanes for accelerating the drying, for improving the adhesion to the metallic surface, particularly at elevated temperatures, and for increasing the resistance to cathodic disbondment.

Coated articles are provided comprising: (a) a substrate that demonstrates electrical conductivity, wherein the substrate is an electronic component of a circuit assembly; (b) a moisture barrier coating layer; and (c) an encapsulating plastic coating layer. The moisture barrier coating layer may be applied to the surface of the substrate with the encapsulating plastic coating layer applied on top of the moisture barrier coating layer, or vice versa.

Coated articles are provided comprising: (a) a substrate that demonstrates electrical conductivity, wherein the substrate is an electronic component of a circuit assembly; (b) a moisture barrier coating layer; and (c) an encapsulating plastic coating layer. The moisture barrier coating layer may be applied to the surface of the substrate with the encapsulating plastic coating layer applied on top of the moisture barrier coating layer, or vice versa.

A method for preparing a paving material includes heating an aggregate comprising recycled asphalt pavement using an emitter generating electromagnetic radiation having a wavelength of from 2 microns to 1 millimeter. The method utilizes solid phase autoregenerative cohesion to prepare a material suitable for use as an aggregate in a hot mix asphalt pavement installation.

A method for preparing a paving material includes heating an aggregate comprising recycled asphalt pavement using an emitter generating electromagnetic radiation having a wavelength of from 2 microns to 1 millimeter. The method utilizes solid phase autoregenerative cohesion to prepare a material suitable for use as an aggregate in a hot mix asphalt pavement installation.

A solvent-free undercoat composition for corrosion control at welds and other repair sites on plastic-sheathed steel pipes with and without cathodic protection, including a component K1: a water-based rubber dispersion for formation of a barrier layer for isolating the metallic repair site from oxygen, water vapor and water penetrating from externally; a component K2: a water-based resin dispersion for adhesion on the metallic surface of the repair site and on the nonpolar surfaces of the plastic sheathing; a component K3: an aqueous emulsion of prehydrolyzed organofunctional silanes for accelerating the drying, for improving the adhesion to the metallic surface, particularly at elevated temperatures, and for increasing the resistance to cathodic disbondment.

A solvent-free undercoat composition for corrosion control at welds and other repair sites on plastic-sheathed steel pipes with and without cathodic protection, including a component K1: a water-based rubber dispersion for formation of a barrier layer for isolating the metallic repair site from oxygen, water vapor and water penetrating from externally; a component K2: a water-based resin dispersion for adhesion on the metallic surface of the repair site and on the nonpolar surfaces of the plastic sheathing; a component K3: an aqueous emulsion of prehydrolyzed organofunctional silanes for accelerating the drying, for improving the adhesion to the metallic surface, particularly at elevated temperatures, and for increasing the resistance to cathodic disbondment.

There is disclosed a composition for forming a conformal gel coating to protect a substrate from various environments, wherein the composition comprises at least one film former, at least one additive and optionally at least one solvent. The composition is deformable, flowable, electrically insulating, and does not contain fluorine when applied as a coating. Gel coatings, methods of applying such coating to substrates, as well as the coated substrates are also disclosed. Non-limiting examples of such substrates include a printed circuit board, an assembled electronic device or an automotive part.

There is disclosed a composition for forming a conformal gel coating to protect a substrate from various environments, wherein the composition comprises at least one film former, at least one additive and optionally at least one solvent. The composition is deformable, flowable, electrically insulating, and does not contain fluorine when applied as a coating. Gel coatings, methods of applying such coating to substrates, as well as the coated substrates are also disclosed. Non-limiting examples of such substrates include a printed circuit board, an assembled electronic device or an automotive part.