Patent classifications
C09D133/066
Method for forming a multilayer coating film and multilayer coating film
An object of the present invention is to provide a method for forming a multilayer coating film with excellent performance such as acid resistance, by using a coating composition which is completely different from conventional clear coating compositions and cheaper than conventional non-melamine curing type, acid/epoxy type, and isocyanate type clear coating compositions. A method for forming a multilayer coating film comprising a step (1) of applying a base coating composition and a step (2) of applying a clear coating composition on a coating film formed in the step (1), wherein the clear coating composition causes a curing reaction through a transesterification reaction between a hydroxyl group and an alkyl ester group.
Random copolymer, laminate, and method for forming pattern
Provided are a random copolymer for forming a neutral layer promoting directed self-assembly pattern formation, a laminate for forming a pattern including the same, and a method for forming a high-quality pattern using the same.
ANTI-REFLECTION COATING COMPOSITION AND USE THEREOF
Provided is an anti-reflection coating composition. The anti-reflection coating composition includes an active component and a solvent B. The active component includes a matting resin A, a catalyst C, and a crosslinking agent D. The weight average molecular weight of the matting resin A is less than or equal to 20000. Also provided is use of the anti-reflection coating composition.
Photo-curable coating composition and coated article
A photo-curable coating composition comprising (1) a polyfunctional (meth)acrylic monomer, (2) a photopolymerization initiator, and (3) a specific hydroxyphenyltriazine base UV absorber has high mar resistance and long-term weather resistance.
D1563 RADIATION CURABLE SECONDARY COATING FOR OPTICAL FIBERS
A radiation curable secondary coating composition for optical fiber is described and claimed. This radiation curable secondary coating composition includes component (A) which is a urethane (meth)acrylate and component (B) which is a (meth)acrylate compound with two or more ethylenically unsaturated groups and one or more bisphenol structures; wherein the content of component (B) in the composition is 60-300 mass parts per 100 mass parts of component (A). The liquid secondary coating has a viscosity at 25° C. of from about 0.1 Pa.Math.s to about 15 Pa.Math.s. Films obtained by curing the liquid radiation curable secondary coating composition of the present invention have a Young's modulus of from about 600 MPa to about 500 MPa and the breaking elongation of the cured film is from about to 5% to about 50%.
Underfill material and method for manufacturing semiconductor device using the same
An underfill film material and a method for manufacturing a semiconductor device using the same which enables voidless mounting and favorable solder bonding properties are provided. An underfill material is used which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, the underfill material exhibits non-Bingham fluidity at a temperature ranging from 60° C. to 100° C., a storage modulus G′ measured by dynamic viscosity measurement has an inflection point in an angular frequency region below 10E+02 rad/s, and the storage modulus G′ in the angular frequency below the inflection point is 10E+05 Pa or more and 10E+06 Pa or less. This enables voidless packaging and excellent solder connection properties.
Underfill material and method for manufacturing semiconductor device using the same
An underfill film material and a method for manufacturing a semiconductor device using the same which enables voidless mounting and favorable solder bonding properties are provided. An underfill material is used which contains an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, the underfill material exhibits non-Bingham fluidity at a temperature ranging from 60° C. to 100° C., a storage modulus G′ measured by dynamic viscosity measurement has an inflection point in an angular frequency region below 10E+02 rad/s, and the storage modulus G′ in the angular frequency below the inflection point is 10E+05 Pa or more and 10E+06 Pa or less. This enables voidless packaging and excellent solder connection properties.
Radiation curable composition
The present invention generally relates to the field of radiation curable compositions comprising (meth)acrylated acrylic polymers comprising pendant hydroxyl groups, methods for making these radiation curable compositions and their uses.
Coating material composition, and light-diffusing member manufactured using said coating material composition
A coating material composition include a hydroxyl group-containing acrylic resin, a fluororesin, and light diffusive particles, and the hydroxyl group-containing acrylic resin has a weight-average molecular weight in a range of 10,000 to 30,000 and a hydroxyl value in a range of 14 to 70, wherein a mass ratio of the fluororesin to the hydroxyl group-containing acrylic resin (the fluororesin/the hydroxyl group-containing acrylic resin) is in a range of 5/95 to 50/50. The coating material composition can provide the light diffusing properties capable of uniformly diffusing light while effectively masking a light source image.
OPACIFYING COMPOSITIONS FOR PVC FILMS
Various coating compositions are described which provide protection for polymeric films and particularly PVC films. The coating compositions include particular resin(s) and opacifying agents. Also described are coated films utilizing the compositions and methods of forming the coated films.