A resist underlayer film-forming composition includes: a polymer; and a solvent, in which the polymer has, in a side chain, one or two or more polymerizable multiple bonds selected from the group consisting of a carbon-carbon double bond, a carbon-carbon triple bond, a carbon-nitrogen double bond, and a carbon-nitrogen triple bond.

Provided is a composition for an electrochemical device functional layer with which it is possible to form a functional layer that has excellent wet adhesiveness and that is capable of good inhibition of metal deposition on an electrode during charging and discharging and swelling of an electrochemical device. The composition for an electrochemical device functional layer contains a particulate polymer including a structural unit that includes a group having an aromatic ring where at least one hydrogen atom is substituted with a hydroxy group.

A resin composition, a cured layer, a manufacturing method of a cured layer and an etching method are provided. The resin composition includes a resin (A), a crosslinking agent (B) and a solvent (C). The resin (A) includes a structure represented by the following Formula (A-1). The crosslinking agent (B) includes a polymer including a first structural unit represented by the following Formula (B-1) and a second structural unit represented by the following Formula (B-2). Based on a usage amount of the resin (A) being 100 parts by weight, a usage amount of the crosslinking agent (B) is 60 parts by weight to 150 parts by weight, and a usage amount of the solvent (C) is 2400 parts by weight to 99900 parts by weight.

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In Formula (A-1), Formula (B-1) and Formula (B-2), the definition of each substituent is the same as defined in the specification.

A coating composition (e.g., a paint) may include: a pigment; a filler, a polymer dispersion; and a thickener. The polymer dispersion may include a polymer formed by radically initiated emulsion polymerization of a monomer mixture comprising ethylenically unsaturated monomers that comprise (i) one or more carboxylic acid-functional monomers in an amount to yield 10.0-22.0 mmol carboxylic acid groups per 100 g monomer mixture and (ii) one or more epoxy-functional monomers in an amount to yield 3.0-10.0 mmol epoxy-functional groups per 100 g monomer mixture.