Patent classifications
C09D133/068
Polymer material, composition, and method of manufacturing semiconductor device
According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.
Polymer material, composition, and method of manufacturing semiconductor device
According to one embodiment, a polymer material is disclosed. The polymer material contains a polymer. The polymer contains a first monomer unit having a lone pair and an aromatic ring at a side chain, and a second monomer unit including a crosslinking group at a terminal of the side chain, with its molar ratio of 0.5 mol % to 10 mol % to all monomer units in the polymer. The polymer material can be used for manufacturing a composite film as a mask pattern for processing a target film on a substrate. The composite film can be formed by a process including, forming an organic film on the target film with the polymer material, patterning the organic film, and forming the composite film by impregnating a metal compound into the patterned organic film.
Scratch and Mar Resistant Automotive Coatings
Described herein is a 2K solvent borne coating system. The coating system includes an epoxy component (A), including: i) an epoxy resin; ii) a solvent; iii) at least one compound of formula (I):
[(ER).sub.x(R′O).sub.y(HO).sub.z(R″).sub.t(SiO.sub.(4-x-y-z-t)].sub.m (I)
and/or oligomer or polymer compounds of the compound of formula (I), and iv) optionally, at least one non-catalytic additive; and an acid resin component (B), including: an carboxylic acid resin; a solvent; optionally, at least one catalyst; and optionally, at least one additive. Also described herein are a 2K coating composition, a method to coat an automotive substrate with the composition, and a scratch and mar resistant coated surface of the 2K coating composition.
Hollow particles and use thereof
Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.
OXIRANE-FUNCTIONAL VINYL MONOMERS AND METHODS FOR MAKING THE SAME
A method for making a monomer includes reacting an alkanol-substituted phenol with epihalohydrin in the presence of a phase transfer catalyst at a temperature of 50° C. or lower to produce a first intermediate product. The method further includes removing excess epihalohydrin, and after removing excess epihalohydrin, contacting the first intermediate product with a base to produce a second intermediate product, and forming an oxirane-functional vinyl monomer from the second intermediate product. The monomer includes an oxirane group, an unsaturated vinyl bond, and optionally an aromatic spacer between the two functional groups.
SOIL AND DIRT REPELLENT POWDER COATINGS
A dirt repellant panel coated with a powder coating composition that includes a polymeric binder and an anionic fluorosurfactant present in an amount ranging from about 0.1 wt. % to about 4 wt. %.
Positive-type photosensitive resin composition and cured film prepared therefrom
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.
HOLLOW PARTICLES AND USE THEREOF
Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.
Protective film forming composition having an acetal structure
A protective film-forming composition which protects against a semiconductor wet etching solution, contains a solvent and a compound or polymer thereof containing at least one acetal structure in a molecule thereof, and forms a protective film exhibiting excellent resistance against a semiconductor wet etching solution during the lithographic process when producing semiconductors; a method for producing a resist pattern-equipped substrate which uses the protective film; and a method for producing a semiconductor device.
LAMINATE, OPTICAL DEVICE, AND DISPLAY DEVICE
An object of the present invention is to provide a laminate including a light absorption anisotropic layer, in which a decrease in a degree of polarization is suppressed even in a case where the laminate is simultaneously stretched in a plurality of directions, and an optical device and a display device, each using the laminate. The laminate of an embodiment of the present invention is a laminate having at least a resin substrate and a light absorption anisotropic layer, in which a tan δ peak temperature of the resin substrate is 170° C. or lower, the light absorption anisotropic layer includes a liquid crystalline compound and a dichroic substance, and an alignment degree of the dichroic substance is 0.95 or more.