Patent classifications
C09D133/068
Resin composition
There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.0% by mass with respect to the content of all components of the resin composition, except the solvent: (A) component: a self-crosslinking copolymer having a structural unit of Formula (1) below and a structural unit of Formula (2) below (B) component: a compound of Formula (3) below ##STR00001##
wherein R.sup.0 is each independently a hydrogen atom or a methyl group, X is O or NH, R.sup.1 is a single bond or an alkylene group, R.sup.2 is an alkyl group, a is an integer of 1 to 5, b is an integer of 0 to 4, R.sup.3 is a divalent organic group having an ether bond and/or an ester bond, R.sup.5 is an alkyl group, f is an integer of 1 to 5, g is an integer of 0 to 4, R.sup.6 is a single bond or an alkylene group, Y is a single bond or an ester bond, A is a mono- to tetra-valent organic group which optionally contain at least one hetero atom, or a hetero atom, and h is an integer of 1 to 4.
Adhesion promoting and/or dust suppression coating
An adhesion promoter coating composition includes an oligomeric alkylalkoxysiloxane and a compound comprising an electrophile moiety and an alkoxysilyl moiety. The electrophile moiety may contain a sulfide functional group, for example. A dust suppression coating composition includes an acrylic polymer comprising a quaternary ammonium moiety; and an oligomeric alkylalkoxysiloxane. The coating composition may be applied to roofing granules, and/or asphaltic compositions, among other things.
Soil and dirt repellent powder coatings
A dirt repellant panel coated with a powder coating composition that includes a polymeric binder and an anionic fluorosurfactant present in an amount ranging from about 0.1 wt. % to about 4 wt. %.
PROTECTIVE FILM-FORMING COMPOSITION
A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent:
##STR00001##
(wherein R.sub.1 is a C.sub.1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)
Thermal transfer recording medium
A thermal transfer recording medium that is capable of dealing with the requirement for an increase in thermal transfer printing speed, and high density and high quality of a thermally transferred image, capable of preventing the occurrence of abnormal transfer at high temperature and high humidity, and capable of improving transfer sensitivity in printing. A thermal transfer recording medium includes a heat-resistant lubricating layer on one surface of a base material, and an undercoat layer and a dye layer in that order on the other surface of the base material. The undercoat layer includes a copolymer of a polyester having a sulfonic acid group and an acrylic polymer having at least one of a glycidyl group and a carboxyl group, polyvinylpyrrolidone, and an oxazoline group-containing polymer. A binder resin of the dye layer is an acid-modified polyvinyl acetoacetal resin.
Pattern forming material, pattern forming method, and method for manufacturing semiconductor device
The pattern forming material of an embodiment is a pattern forming material containing a polymer composed of two or more kinds of monomer units, in which a first monomer unit in the monomer units is provided with an ester skeleton having a first carbonyl group and one or more second carbonyl groups which bind to the ester skeleton, among the second carbonyl groups, the second carbonyl group that is farthest from a main chain of the polymer constituting the pattern forming material is present on a linear chain, and a second monomer unit in the monomer units is provided with a crosslinkable functional group on a side chain terminal.
Waterborne acrylic dispersions with high biorenewable content
An aqueous copolymer dispersion is formed by emulsion polymerization of a monomer mixture comprising (a) 20 to 80 wt. % of one or more (meth)acrylic acid esters A, whose homopolymer(s) have a T.sub.g>25 C. and at least one has a biorenewable carbon content of at least 50 wt. % of the total carbon content of the ester; (b) 19 to 79 wt. % of one or more (meth)acrylic acid esters B whose homopolymer(s) have a T.sub.g<25 C.; (c) 0.5 to 10 wt. % of at least one monomer selected from unsaturated sulfonic, phosphoric and phosphonic acids, and unsaturated carboxylic acids, anhydrides and amides thereof; (d) up to 10% by weight of one or more functional monomers selected from hydrolysable silane compounds, epoxy-containing compounds, ureido-containing compounds and carbonyl-containing compounds, and (e) less than 5 wt. % of one or more further monomers, wherein the total percentages of comonomers (a) to (e) equals 100%.
CLEARCOAT COATING COMPOSITION AND MULTILAYER COATING FILM FORMATION METHOD
The clear coat paint composition comprises (A) a carboxy-containing polymer, (B) an epoxy-containing acrylic resin, and (C) an antioxidant having a phenyl group and a sulfide bond.
CLEARCOAT COATING COMPOSITION AND MULTILAYER COATING FILM FORMATION METHOD
The clear coat paint composition comprises (A) a carboxy-containing polymer, (B) an epoxy-containing acrylic resin, and (C) an antioxidant having a phenyl group and a sulfide bond.
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.