A flashing laminate includes a non-reinforced thermoplastic sheet having a bottom surface, a first longitudinal edge, and a second longitudinal edge. The flashing laminate also includes an adhesive layer on a longitudinally extending portion of the bottom surface adjacent to one of the longitudinal edges. In one or more embodiments, the laminate also includes a release liner positioned over the adhesive tape.

A label comprising a body having a first side for attaching to a container and a second side for displaying information, the first side includes a releasable adhesive for attaching the label to a container, wherein the releasable adhesive is treatable to cause the label to be separated from the container, and at least a part of the body is heat sensitive such that the label curls towards the first side to conceal part of the releasable adhesive when the label is heated to hinder the label separated from the container from re-attaching to the container.

The pressure sensitive adhesive tape is superior in moisture resistance because of its high peel strength and is easy to peel from an adherend by including a filler in the adhesive layers.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

Provided is an adhesive member including: a base material having an uneven shape on at least one surface; and a surface layer covering at least a portion of the surface having the uneven shape on the base material.

A universal barrier system includes universal barrier components that may be assembled together to shield floors and walls from moisture and provide a thermal break in an operational area of the universal barrier component. A lap zone of the universal barrier component may allow universal barrier components to be assembled and installed to protect floors, walls, ceilings, footings and the like from moisture and heat gain or loss by minimizing the need for tapes and other joining methods. The universal barrier system may also act as a sound deadening material. The operational area and lap zone of the universal barrier component may be disposed on a vapor block layer to provide some rigidity. The operational area of the universal barrier component may include a thermal break disposed upon the vapor block layer. The thermal break may include an outer protective layer. In addition, universal barrier tape and universal barrier edging may be provided to couple adjoining universal barrier components.

A wafer processing method includes a sheet bonding step of placing a polyolefin or polyester sheet on a front side of a wafer having a device area where devices are formed so as to be separated by division lines, the sheet having a size capable of covering the device area, and next performing thermocompression bonding to bond the sheet to the front side of the wafer, thereby protecting the front side of the wafer with the sheet. The method further includes a test element group (TEG) cutting step of applying a first laser beam through the sheet to the wafer along each division line thereby cutting a TEG formed on each division line, and a modified layer forming step of applying a second laser beam to a back side of the wafer along each division line, the second laser beam having a transmission wavelength to the wafer, thereby forming a modified layer inside the wafer along each division line.

An auxiliary material for fiber-reinforced composite material processing having a supporting material and an adhesive layer disposed on the supporting material, in which an elastic modulus at 23° C. of the supporting material is 0.1 to 30 GPa.