A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.sup.3.

An uncured or partially cured foxing tape (10) comprises: a two-layer structure of a base foxing tape (11) and an uncrosslinked or partially crosslinked adhesive (12), wherein the base foxing tape (11) comprises an uncured or partially cured rubber, wherein the base foxing tape (11) has a first side and a second side opposite the first side, wherein the uncrosslinked or partially crosslinked adhesive (12) is in contact with the uncured or partially cured rubber on the second side of the base foxing tape (11), wherein the uncrosslinked or partially crosslinked adhesive (12) comprises: an uncured or partially cured rubber; a tackifying resin; and a filler.

An encapsulant sheet suitable for encapsulating a light-emitting element in a self-luminous display, etc. A resin sheet having a polyolefin as a base resin, wherein the resin sheet is created as an encapsulant sheet for a self-luminous display or for a direct backlight, the melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec-1 and measured at a temperature of 120° C., being 5.0×103 poise to 1.0×105 poise inclusive.

A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.sup.3.

The present disclosure relates to a heat dissipation adhesive film and a display device including the same. The heat dissipation adhesive film according to an exemplary embodiment of the present disclosure includes a base film, a first adhesive film on a lower surface of the base film, and a second adhesive film on an upper surface of the base film, and the first adhesive film or the second adhesive film includes an adhesive resin and heat dissipation beads dispersed in the adhesive resin. Accordingly, the heat dissipation characteristic is improved and, at the same time, the substrate or the back cover may be reusable.

The present disclosure relates to a stretchable adhesive film comprising a substrate layer comprising an elastomer; and a first adhesive layer provided on one surface of the substrate layer, wherein the stretchable adhesive film satisfies Equation 1, and a display device comprising the same.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyolefin sheet.

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

A fuel cell includes: a membrane-electrode-gas diffusion layer assembly; a separator positioned in one side with respect to the membrane-electrode-gas diffusion layer assembly; a frame member supporting the membrane-electrode-gas diffusion layer assembly and joined to the separator, wherein the frame member includes: a base layer; an adhesive layer having thermoplasticity, having a linear expansion coefficient greater than that of the base layer, and joining the base layer and the separator; and a coating, layer provided on a side, opposite to the adhesive layer, of the base layer, having a liner expansion coefficient greater than that of the base layer, and not containing an adhesive component.

The present invention aims to provide an impact-absorbing sheet having high impact resistance and excellent resistance against sebum. The present invention also aims to provide a double-sided adhesive sheet including the impact-absorbing sheet. Provided is an impact-absorbing sheet including an impact-absorbing layer, the impact-absorbing layer having a maximum value of loss tangent tan δ of 0.7 or more at a frequency of 1.0×10.sup.3 to 1.0×10.sup.6.5 Hz at 23° C. and having a degree of crystallinity of 2% or higher.