A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

Provided is a double-sided adhesive tape or sheet which is light-weight and has excellent strength and insulating properties even when the thickness of the tape or sheet is small. This double-sided adhesive tape or sheet comprises a laminate including a support and two adhesive agent layers formed on opposite surfaces of the support, wherein the support contains a polypropylene resin, the adhesive agent layers contain an acrylic polymer, the laminate has a total thickness (Ds) of 4-15 m, the value of the ratio Dp/Ds of the thickness (Dp) of the support to the total thickness (Ds) of the laminate is 0.15-0.6, and the laminate has a density of 0.90-1.10 g/cm.sup.3.

Layer constructions allow an adhesive tape to be wound to form a spool simply and with relatively uncomplicated apparatus. At least one layered construction comprises: an adhesive tape comprising at least one outer layer of pressure-sensitive adhesive; a release liner lying on the outer layer of pressure-sensitive adhesive; and an interliner lying on the side of the adhesive tape opposite the outer layer of pressure-sensitive adhesive, at least the side of the interliner facing away from the adhesive tape being adhesively furnished, wherein all layers of the layered construction finish substantially flush with respect to each other. At least one spool comprising a spool core and the at least one layered construction wound crosswise in a plurality of plies on said core, and a method for producing the at least one spool are also disclosed.

ESD labels with a polyester-amino topcoat are provided. The labels may also include a polyester-amino resin in a primer layer. The topcoat and primer layer may comprise conductive particles, and the percentage of conductive particles in the adhesive layer may be reduced. The ESD labels have reduced surface resistance in the topcoat, primer layer, and adhesive layer, while also having reduced peel-off voltage.

Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree S.sub.A of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23 C. for 1 hour.

A wafer processing method includes a sheet bonding step of placing a polyolefin or polyester sheet on a front side of a wafer having a device area where devices are formed so as to be separated by division lines, the sheet having a size capable of covering the device area, and next performing thermocompression bonding to bond the sheet to the front side of the wafer, thereby protecting the front side of the wafer with the sheet. The method further includes a test element group (TEG) cutting step of applying a first laser beam through the sheet to the wafer along each division line thereby cutting a TEG formed on each division line, and a modified layer forming step of applying a second laser beam to a back side of the wafer along each division line, the second laser beam having a transmission wavelength to the wafer, thereby forming a modified layer inside the wafer along each division line.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

A method of installing a roof system, the method comprising (i) providing a first membrane composite including a polymeric planar body having first and second planar surfaces, a UV-cured pressure-sensitive adhesive layer disposed on the second planar surface, a release member removably secured to the pressure-sensitive adhesive layer opposite the planar body; and a primer layer disposed along a lap area on the first planar surface; (ii) adhesively securing the first membrane composite to a roof surface through the UV-cured pressure-sensitive adhesive layer; (iii) providing a second membrane composite including a polymeric planar body having first and second planar surfaces, a UV-cured pressure-sensitive adhesive layer disposed on the second planar surface, a release member removably secured to the pressure-sensitive adhesive layer opposite the planar body; and optionally including a primer layer disposed along a lap area on the first planar surface; (iv) adhesively securing the second membrane composite to the roof surface through the UV-cured pressure-sensitive adhesive layer, where the second membrane composite is positioned adjacent to and partially overlapping the lap area of the first membrane composite; and (v) adhesively securing the second membrane composite to the first planar surface of the first membrane composite along the primer layer through the UV-cured pressure-sensitive adhesive layer disposed on the second membrane composite.

A surface-treated metal sheet for polyolefin adhesion is provided with a metal sheet, a first layer provided on at least one surface of the metal sheet, and a second layer provided on the first layer, wherein the first layer containing an epoxy resin and a blocked isocyanate, the second layer containing an acid-modified polyolefin resin, the thickness of the first layer being 15 to 40 m, and the thickness of the second layer being 4 to 30 m.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyolefin sheet.