Multilayer films and adhesive tapes that include such films, wherein the multilayer films include plasticized polyvinyl chloride and optionally one or more fillers.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer and a styrene-containing block copolymer and an epoxidized polymer, and an adhesive.

The present invention is directed to a heat-activated adhesive patch with integral attachment device wherein said patch can be permanently attached to an article of clothing or other article made of natural or synthetic substrate by means of using heat and pressure, whereby said patch with integral attachment device can be used to attach or hang an article or device from said heat-activated patch using said integral attachment device.

An adhesive tape includes: a substrate made of a fluorine resin; and a silicone-based adhesive agent layer disposed on one surface of the substrate. The adhesive tape has a thickness of 50 μm or more. An adhesive strength of an adhesive surface to the other surface of the substrate after a friction test is 4.0 N/19 mm or more. The friction test is performed according to a test method for coefficient of friction specified in JIS K7125: 1999, and performed in a state where: a contact surface, of a sliding piece used in the test method, brought into contact with a surface to be tested is covered with a single fiber cloth (cotton, for friction) specified in JIS L0803: 2011; the other surface of the substrate is defined as the surface to be tested; and the number of times of reciprocation is set to 10 times.

A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

Multilayer films and adhesive tapes that include such films, wherein the multilayer films include plasticized polyvinyl chloride and optionally one or more fillers.

The present invention provides a pressure-sensitive adhesive composition, including: an acrylic copolymer and a crosslinking agent. The acrylic copolymer is a reaction product of a mixture of the following monomers: a first alkyl (meth)acrylate, an alkyl group in the first alkyl (meth)acrylate having at least 6 carbon atoms; a second alkyl (meth)acrylate, an alkyl group in the second alkyl (meth)acrylate having 1 to 5 carbon atoms; and a vinyl carboxylic acid, the weight ratio of the vinyl carboxylic acid to the mixture being 4% to 5%. The crosslinking agent is an organometallic chelating agent. The weight ratio of the organometallic chelating agent to the mixture is 0.05% to 0.25%. The pressure-sensitive adhesive composition does not contain an effective amount of a tackifier. The present invention further provides a pressure-sensitive adhesive solution, a pressure-sensitive adhesive tape, and a method for preparing the same. The pressure-sensitive adhesive of the present invention is a removable pressure-sensitive adhesive, and is applicable in hot weather and cold weather, and the adhesiveness of the pressure-sensitive adhesive does not decrease over time.

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer, and an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, a cross-linking step of cross-linking the unevenness-absorbing resin layer (C) by applying an external stimulus to the unevenness-absorbing resin layer (C) in the structure, and a sealing step of sealing the electronic component with a sealing material.

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.

The invention relates to a method for forming an article comprising a pathway of particles wherein a termination of the pathway of particles is exposed. The method comprises arranging the particles by applying an electric field and/or a magnetic field at an interface between a water soluble or a non-water soluble matrix and a matrix comprising a viscous material and particles. After fixating the viscous material, the termination is exposed by dissolving the water soluble or non-water soluble matrix. The invention also relates to articles obtainable by said method, and to the use of said method in various applications.