A kit for protecting a display screen of an electronic device having an in-screen fingerprint sensor is provided. The kit includes a screen protector at least partially formed from a transparent material and an interface coupler configured to be positioned between the screen protector and the display screen proximate the in-screen fingerprint sensor. The interface coupler includes a transparent carrier layer, a first adhesive layer, and a second adhesive layer. The first adhesive layer is positioned on a first surface of the transparent carrier layer and configured to be affixed to the display screen of the electronic device, the first adhesive layer comprising a silicone adhesive or a gel or a gel-like material. The second adhesive layer is positioned on a second surface of the transparent carrier layer and configured to be affixed to the screen protector.

A silicone pressure sensitive adhesive composition containing: (A) a polydiorganosiloxane gum having a number average molecular weight≥500,000 g/mol, where the polydiorganosiloxane gum is terminated with an aliphatically unsaturated group; (B) a polydiorganosiloxane polymer having a number average molecular weight≤100,000 g/mol and an aliphatically unsaturated group content of >0.13 weight %; where starting materials (A) and (B) are present in a weight ratio (B)/(A) of 0.4 to 1.6; (C) a polyorganosilicate resin having a number average molecular weight<4,000 g/mol, where starting materials (A), (B) and (C) are present in a weight ratio (C)/(B+A) of 1.4 to 2; (D) a polyorganohydrogensiloxane; where starting materials (A), (B), and (D) are present in amounts sufficient to provide a molar ratio of silicon bonded hydrogen atoms/silicon bonded aliphatically unsaturated groups (SiH/Vi ratio) of 4 to 30 in the composition; (E) a hydrosilylation reaction catalyst; (F) an anchorage additive; and (G) a solvent. It is suitable for use in protective films for ultrasonic fingerprint sensors in display devices.

A silicone pressure sensitive adhesive composition contains an alkenyl-functional polydiorganosiloxane gum, a polyorganosilicate resin, a polyorganohydrogensiloxane crosslinker, a migration reducing additive, a hydrosilylation reaction catalyst, a hydrosilylation reaction inhibitor, and a solvent. Methods for preparing the silicone pressure sensitive adhesive composition and using it to form a protective film are provided.

The present disclosure provides an adhesive composition for a dicing film, a dicing film, and a dicing die-bonding film, which have excellent pickup performance.

A method for ablating a label having a topcoat layer and a sacrificial layer includes irradiating at least one target region on the topcoat layer with a laser beam and further includes removing the topcoat layer and at least a portion of the sacrificial layer in the at least one target region.

An objective is to provide a method for judging the authenticity of a product or component. Provided is a method for judging product or component authenticity. The method includes a step of determining the percentage of radioactive carbon-14 based on ASTM 6866 with respect to at least one constituent that a product or component of interest obtained has. Here, at least one constituent that an authentic product or component has and that corresponds to the constituent of the product or component of interest includes a resin comprising a prescribed percentage of radioactive carbon-14.

This invention provides a readily adhesive polyester film that has fewer flaws and in which no appearance defects occur due to tight winding during the storage of rolled products, and a method for efficiently producing the readily adhesive polyester film. More specifically, this invention provides a readily adhesive polyester film comprising a polyester film as a base film and a readily adhesive layer on at least one side of the base film, wherein the base film contains particles with an average particle diameter of 0.1-2 μm or more in an amount of 1 mass % or less based on the mass of the base film, and the readily adhesive layer is a cured product of a composition comprising a copolymerized polyester resin (A), a blocked isocyanate group-containing urethane resin (B), and a silicone surfactant (C). This invention also provides a method for producing a readily adhesive polyester film.

Acrylic polymers and pressure sensitive adhesive compositions prepared from (i) from about 1 to about 10 wt % of a carboxy functional monomer component, (ii) from about 50 to about 90 wt % of a low Tg alkyl acrylate monomer component, (iii) from about 1 to about 20 wt % of a tertiary amine functionalized alkyl acrylate monomer component, and (iv) optionally, up to 50 wt % of a vinyl ester monomer component are disclosed. The acrylic polymers and pressure sensitive adhesives are ideally suited for skin contact applications, particularly as diagnostic patches, transdermal drug-delivery patches, and dermal patches for delivery of skin actives.

A pressure sensitive adhesive includes an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment. In the acryl-based base polymer, the content of the urethane-based segment is 3 to 20 parts by weight based on 100 parts by weight of the acryl-based segment. A pressure sensitive adhesive sheet can be obtained by applying a pressure sensitive adhesive composition on a substrate in a layer form. The pressure sensitive adhesive composition may be curable and may include a polymerization initiator. In formation of the pressure sensitive adhesive sheet, the curable pressure sensitive adhesive composition may be, as necessary.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.