The invention relates to adhesive strips consisting of at least four, particularly precisely four layers, comprising: a layer A having an upper side and a lower side consisting of a foamed adhesive substance containing a self-adhesive acrylate substance; a layer B consisting of a film carrier, layer B being arranged on the lower side of layer A, at least the main surface which faces layer A, preferably both main surfaces of the film carrier, being etched, the surface of layer A and the surface of layer B being in direct contact with each other; a layer C consisting of a self-adhesive substance, arranged on the upper side of layer A and containing a self-adhesive acrylate substance; and a layer D consisting of a self-adhesive substance, arranged on the side of layer B opposite layer A and containing a self-adhesive acrylate substance.

A PSA film includes a base material and a PSA layer on at least one side of the base material. The PSA layer has a temperature region, within the range of 70° C. to 100° C., in which its loss tangent tanδ is 0.8 or greater. The PSA film can be peeled off through irradiation with active energy radiation.

Provided are an adhesive tape having high flex resistance that can withstand repeated bending by folding operations and the like while maintaining high impact resistance, and an electronic device including the adhesive tape. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed, in which the foam base contains an elastomer resin as a main component. The foam base has a tensile stress of 150 N/cm.sup.2 or less at 100% strain based on a stress-strain curve and a foam density of 0.2 g/cm.sup.3 to 2.0 g/cm.sup.3.

A multilayer adhesive sheet, an optical member including the same, and a display apparatus including the same are provided. A multilayer adhesive sheet includes: a base layer; a first adhesive layer stacked on a surface of the base layer; and a second adhesive layer stacked on another surface of the base layer, and the base layer includes a polyurethane-based film manufactured by solution casting and has a storage modulus of 700 MPa to 1,500 MPa at −20° C. and a storage modulus of 10 MPa to 100 MPa at 85° C.

The present invention refers to a method for producing preferably water-based polymeric compositions, preferably dispersions (i.e. latices), which are particularly useful as or in adhesives, especially pressure-sensitive adhesives (PSAs), particularly pressure-sensitive adhesives removable under neutral or basic (i.e. alkaline) conditions, as well as to the polymeric compositions thus produced and to their various applications, including the copolymers comprised by these polymeric compositions.

A method for producing a pressure-sensitive adhesive sheet of the present invention includes: forming a pressure-sensitive adhesive layer 10 formed of a transparent, light-cured base pressure-sensitive adhesive material on a support S1; irradiating the pressure-sensitive adhesive layer 10 with an ultraviolet ray U to cure the pressure-sensitive adhesive layer; providing a solution 12 of an ultraviolet absorbing agent 11; applying the solution 12 to one of opposite surfaces of the cured pressure-sensitive adhesive layer 10a to cause the ultraviolet absorbing agent 11 contained in the solution 12 to infiltrate from the one surface in a thickness direction of the pressure-sensitive adhesive layer 10a; and drying the pressure-sensitive adhesive layer 10a.

According to various embodiments of the present disclosure, a composition includes about 5 to about 40 parts by weight of a solute copolymer component. The solute component optionally has one T.sub.g or T.sub.m of at least 25° C. The composition further includes about 60 to about 95 parts by weight of a solvent monomer. The solvent monomer component includes (meth)acrylate monomers and a multifunctional acrylate. The sum of the solute copolymer component and the solvent monomer component is 100 parts by weight. The composition further includes about 5 to about 100 parts of a plasticizer, relative to the 100 parts.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

Adhesive composition and articles are described comprising a carrier substrate (e.g. release liner or backing) and an adhesive composition disposed on the carrier substrate. The adhesive composition comprises at least 20 wt.% of a polymer; unpolymerized cyclic olefin; and a (e.g. latent) ring opening metathesis polymerization catalyst or precatalyst thereof. The polymer may have a Tg less than 25° C. and/or may be an acrylic polymer. Also described is a method of bonding.

Provided are methods and systems for dispensing filament adhesive onto a target substrate. A filament adhesive is applied on a target substrate according to a bead application plan, then the applied bead is checked against performance criteria. A second bead application plan is generated, and subsequent filament bead applied according to the second bead application plan.