An adhesive tape has adhesive strength with high high-load holding power, temporal repeelability, and storage stability. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 100 MPa and an elongation at break in a range of 300% to 3000%. The adhesive layer contains a tackifier resin and a triblock copolymer with a repeating unit represented by the general formula (1):

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A, B, and C independently denote a repeating unit. A and C independently denote an alkyl methacrylate monomer unit and B denotes an alkyl acrylate monomer unit. p, q, and r independently denote the degree of polymerization of their respective monomer units. A and C may be the same or may denote an alkyl methacrylate monomer unit with a different chemical structure. * denotes a bonding arm to another atom.

Tape constructions having a pressure sensitive adhesive containing a block copolymer component that includes a midblock segment and a plurality of end block segments, each end block segment comprising polystyrene, a (meth)acrylic functional additive having a glass transition temperature of from 50° C. to 160° C., a first tackifier compatible with the midblock segment and containing a hydrocarbon, and a second tackifier compatible with the end block segments and containing a polyphenylene ether that can be incorporated into articles. The pressure sensitive adhesive is subjected to electron beam radiation.

The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet. Provided is an adhesive sheet including at least one adhesive layer, the adhesive layer containing a base polymer, a tackifier resin (T1) having a hydroxy value of less than 20 mgKOH/g, and a tackifier resin (T2) having a hydroxy value of 20 mgKOH/g or more and 120 mgKOH/g or less, the base polymer being a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and the adhesive layer containing the tackifier resin (T1) in an amount of 10 parts by weight or more and 60 parts by weight or less relative to 100 parts by weight of the base polymer, and the tackifier resin (T2) in an amount of 1 part by weight or more and 40 parts by weight or less relative to 100 parts by weight of the base polymer.

The present disclosure provides a hot melt tape at least including a substrate, an adhesive layer, and an anti-sticking layer, wherein the anti-sticking layer is adjacent to the adhesive layer and is the outermost layer of the hot melt tape. The hot melt tape may be used to seal objects, and preferably is made of a multilayer co-extrusion process. The anti-sticking layer prevents the hot melt tape from sticking the objects without needing a release film, and the hot melt tape can be directly heated during sealing the objects.

The invention relates to a hot-melt pressure sensitive adhesive composition comprising at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil and from 4 to 15% by weight of at least one wax selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, ethylene-vinyl acetate waxes and any mixture thereof, based on the total weight of the hot-melt pressure sensitive adhesive composition. The invention also relates to an article comprising a surface coated with such a hot-melt pressure sensitive adhesive composition, to a use of such a hot-melt pressure sensitive adhesive composition and to a process for preparing such a hot-melt pressure sensitive adhesive composition.

Modification of functional groups along a polymer backbone to render the groups activatable upon exposure to actinic radiation is described. The polymers are typically controlled architecture polymers. Also described are adhesives containing the modified architectured polymers and related methods of use.

Disclosed herein is a bio-based copolymer comprising in polymerized form (i) at least one polymerizable bio-based monomer containing one phenolic hydroxyl group which has been derivatized to provide at least one polymerizable functional group which is an ethylenically unsaturated functional group (such as a [meth]acrylate group), where the precursors of the polymerizable bio-based monomers are derived from raw lignin-containing biomass, and (ii) at least one ion-conducting co-monomer other than the bio-based monomer. Also disclosed herein are binders comprising the bio-based copolymer, electrodes comprising the binder, polymer electrolytes comprising the bio-based copolymer and an electrochemical device comprising an electrode in electrical contact with a polymer electrolyte, wherein at least one of the electrode and the polymer electrolyte comprises the bio-based copolymer.

An adhesive that comprises: (a) 35 to 55 wt. % of an elastomer component; (b) 20 to 45 wt. % of an adhesive resin component; and (c) 15 to 40 wt. % of a plasticizing component, wherein (c1) 8 to 35 wt. % of (c) is made of one or more plasticizing oils, and (c2) optionally up to 32 wt. % of (c) is made of one or more plasticizers that differ from plasticizing oils.

A UV-crosslinkable HMPSA composition comprises 10-24% by weight of a block copolymer comprising a styrenic block and a polybutadiene block comprising at least 25% by weight of the 1,2-vinyl unit; 43-65% by weight of a tackifying resin obtained by polymerization, then complete or partial hydrogenation of a C9 fraction, having a softening point of 80-150° C.; 10-25% by weight of a petroleum-derived hydrocarbon oil; and an appropriate amount of a photoinitiator (D). A self-adhesive article comprises a carrier layer (b) coated with a self-adhesive layer (a) comprising the HMPSA composition in the crosslinked state.

The present invention relates to a redetachable adhesive tape having a carrier based on a crosslinked polyurethane and an adhesive layer based on vinylaromatic block copolymer, to a method for producing the adhesive tape and the use of the adhesive tape in the production of electronic components.