C09J125/10

Redispersible polymer powder

The present invention relates to a water redispersible polymer powder (RDP) which comprises a co-dried admixture of a water-insoluble film forming polymer, a colloidal stabilizer and rubber particles. The presence of rubber within the RDP does not significantly affect redispersibility and may, when incorporated into hydraulically-binding compositions, provide an improvement in the physical properties of the resultant hydraulically bound composition.

HOT MELT ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PRODUCING ADHESIVE TAPE

A hot melt adhesive composition which can realize moderate adhesive strength with respect to the adherend when porous substrate is used, the composition, including: a styrene-based block copolymer; a tackifier; and a plasticizer; wherein: the styrene-based block copolymer is a styrene-butadiene block copolymer and a butadiene portion thereof is partially hydrogenated; the tackifier is contained by 65 to 190 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer; and the plasticizer is contained by 0.1 to 24 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer.

HOT MELT ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PRODUCING ADHESIVE TAPE

A hot melt adhesive composition which can realize moderate adhesive strength with respect to the adherend when porous substrate is used, the composition, including: a styrene-based block copolymer; a tackifier; and a plasticizer; wherein: the styrene-based block copolymer is a styrene-butadiene block copolymer and a butadiene portion thereof is partially hydrogenated; the tackifier is contained by 65 to 190 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer; and the plasticizer is contained by 0.1 to 24 parts by mass with respect to 100 parts by mass of the styrene-based block copolymer.

Electronic device, method and apparatus for producing an electronic device, and composition therefor
11240916 · 2022-02-01 · ·

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

ADHESIVE LAYER-EQUIPPED LAMINATE, AND FLEXIBLE COPPER-CLAD LAMINATE SHEET AND FLEXIBLE FLAT CABLE USING SAME
20170259544 · 2017-09-14 ·

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

TIRE WITH ETHYLENE-VINYL ALCOHOL COPOLYMER INNERLINER
20220169076 · 2022-06-02 ·

The present invention is directed to a pneumatic tire comprising a carcass and an innerliner in direct contact with the carcass, the innerliner comprising a film comprising an ethylene vinyl alcohol copolymer; and an adhesive layer disposed between the film and the carcass, the adhesive layer comprising a resorcinol-formaldehyde-latex (RFL) adhesive.

TIRE WITH ETHYLENE-VINYL ALCOHOL COPOLYMER INNERLINER
20220169076 · 2022-06-02 ·

The present invention is directed to a pneumatic tire comprising a carcass and an innerliner in direct contact with the carcass, the innerliner comprising a film comprising an ethylene vinyl alcohol copolymer; and an adhesive layer disposed between the film and the carcass, the adhesive layer comprising a resorcinol-formaldehyde-latex (RFL) adhesive.

HOT MELT COMPOSITION
20220145142 · 2022-05-12 ·

An objective of the present invention is to provide a hot melt composition having a high form maintaining property at a high temperature and being in excellent adhesion to a substrate and in disassembly. The present invention relates to a hot melt composition comprising: (A1) a styrene-ethylene-ethylene/propylene-styrene block copolymer (SEEPS) and (B1) a hydrocarbon-based oil having an aniline point of 135° C. or more.

HOT MELT COMPOSITION
20220145142 · 2022-05-12 ·

An objective of the present invention is to provide a hot melt composition having a high form maintaining property at a high temperature and being in excellent adhesion to a substrate and in disassembly. The present invention relates to a hot melt composition comprising: (A1) a styrene-ethylene-ethylene/propylene-styrene block copolymer (SEEPS) and (B1) a hydrocarbon-based oil having an aniline point of 135° C. or more.

Solvent composition, adhesive composition, and method of bonding surfaces

In an embodiment a solvent composition can comprise, based on the total volume of the solvent composition, 10 to 95 volume percent of a first solvent, wherein the first solvent has Hansen solubility parameters of: 15 MPa.sup.0.5≤δ.sub.D≤17 MPa.sup.0.5, 4≤δ.sub.P≤10.5 MPa.sup.0.5, and 7≤δ.sub.H≤10 MPa.sup.0.5; 5 to 95 volume percent of a second solvent, wherein the second solvent has Hansen solubility parameters of: 16 MPa.sup.0.5≤δ.sub.D≤17.5 MPa.sup.0.5, 0≤δ.sub.P≤3 MPa.sup.0.5, and 0≤δ.sub.H≤3 MPa.sup.0.5; and 0 to 85 volume percent parachlorobenzotrifluoride; wherein the amounts of the first solvent, the second solvent, and parachlorobenzotrifluoride sum to at least 85 volume percent. The first solvent can comprise methyl acetate, acetone, dimethyl carbonate, ethyl acetate, n-butylamine, propyl acetate, tetrahydrofuran, or a combination thereof. The second solvent can comprise cyclohexene, cyclohexane, cyclopentane, methylcyclohexane, or a combination thereof. The solvent compositions are particularly useful in an adhesive composition. An adhesive composition includes the solvent composition, a rubber, and a tackifying resin. A method of bonding two surfaces is also described.