A lighting device disclosed in an embodiment of the invention includes a substrate; a light emitting device disposed on the substrate; a resin layer sealing the light emitting device on the substrate; and a diffusion layer or a reflective substrate disposed on the resin layer, wherein the resin layer includes an oligomer, a monomer, and an additive, wherein the monomer includes IBOA (Iso-bornyl Acrylate), two or more dilution monomers and glycidyl methacrylate (GMA), the additive includes a photoinitiator and an amine-based light stabilizer, and in the oligomer and the monomer, the content of glycidyl methacrylate is 10 to 15%, and the resin layer may be a curable transparent resin cured by ultraviolet light.

The present invention provides a UV debondable pressure sensitive adhesive composition and an adhesive tape comprising the same. The UV debondable pressure sensitive adhesive composition comprises a polyacrylate pressure sensitive adhesive, a UV-light polymerizable polyurethane oligomer, a cationic photoinitiator and a free radical photoinitiator, wherein polymerization monomers of the polyacrylate pressure sensitive adhesive comprise an acrylic monomer having an epoxy functional group. The UV debondable pressure sensitive adhesive composition has a bonding force dropping significantly upon UV irradiation, and leaves no residual adhesive.

The present invention provides a UV debondable pressure sensitive adhesive composition and an adhesive tape comprising the same. The UV debondable pressure sensitive adhesive composition comprises a polyacrylate pressure sensitive adhesive, a UV-light polymerizable polyurethane oligomer, a cationic photoinitiator and a free radical photoinitiator, wherein polymerization monomers of the polyacrylate pressure sensitive adhesive comprise an acrylic monomer having an epoxy functional group. The UV debondable pressure sensitive adhesive composition has a bonding force dropping significantly upon UV irradiation, and leaves no residual adhesive.

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

A heat-resistant laminate including a substrate and an adhesive layer, the adhesive layer including a (meth)acrylic adhesive polymer and a self-crosslinking (meth)acrylic copolymer having an epoxy group and an epoxy group-reactive functional group, the adhesive layer having a sea-island structure including a sea including the (meth)acrylic adhesive polymer and an island including the self-crosslinking (meth)acrylic copolymer, and the laminate having a 180 degree peeling force of 0.9 N/cm or more after bonding to a SUS board and leaving at 120° C. for 30 minutes as measured at a temperature of 60° C. and a peeling speed of 300 mm/min.

Provided is a film touch sensor comprising a separation layer; a protective layer formed on the separation layer; an electrode pattern layer formed on the protective layer; and an insulation layer formed on the electrode pattern layer, wherein the protective layer is a cured layer of a protective layer forming composition comprising a cyclic olefin polymer having a protonic polar group and a curing agent comprising a polyamide-imide resin in a specific mixing ratio. The film touch sensor has improved mechanical properties of the protective layer, so that the occurrence of cracks can be suppressed during a manufacturing process or transfer.

To provide an antistatic laminate and an antistatic adhesive agent capable of maintaining antistatic performance and adhesive force necessary during high-temperature heat treatment, easily removable from an adherend after heat treatment, and capable of reducing or eliminating contaminants such as an antistatic agent and an adhesive agent residue present on an adherend obtained after the removal.

Acrylic copolymers that include the controlled placement of particular functional groups within the polymer structure are provided. The copolymers contain at least two reactive segments and are manufactured via a controlled radical polymerization process. The copolymers are useful in the manufacture of adhesives and elastomers.

The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass M.sub.W of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass M.sub.W of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.