The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic copolymer having a dissolution rate to a developer in a specific range and a compound containing a phenolic hydroxyl group, so that it is possible to attain a high contrast and a high sensitivity pattern when a cured film is formed. Further, it is possible to further enhance the adhesiveness of a pattern when a half-tone, as well as a full-tone, is formed.

The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid monomer and a first vinyl monomer, and (ii) a second-stage polymer containing a meth acrylic acid monomer and a second vinyl monomer, with the proviso that the second vinyl monomer is different than the meth acrylic acid monomer. The first-stage polymer is bound to the second-stage polymer.

The present invention relates to an aqueous dispersion of polymer particles and its preparation process, to an adhesive composition comprising the aqueous dispersion and to the use of the adhesive composition for adhering a label on a bottle.

The present invention relates to an aqueous dispersion of polymer particles and its preparation process, to an adhesive composition comprising the aqueous dispersion and to the use of the adhesive composition for adhering a label on a bottle.

An acrylic pressure-sensitive adhesive (PSA) includes an acrylic polymer produced by free radical polymerization, having a weight-average molecular weight (M.sub.w) of less than 830 kDa; a relative peak width at half height (PWHH) of the acrylic polymer is 1.75 or less or, the acrylic polymer has an entanglement molecular weight (M.sub.e) of less than 50 kg/mol, the relative PWHH of the acrylic polymer being the ratio of an absolute PWHH of the acrylic polymer determined from differentiated DSC signal of the acrylic polymer at glass transition temperature (T.sub.g) to an absolute PWHH of a reference acrylic polymer obtained by reacting ethyl acrylate and acrylic acid in a weight ratio of 100:5 with 10 mmol/l AIBN, wherein the absolute PWHH of the reference acrylic polymer is determined in the same manner as the absolute PWHH of the acrylic polymer, and M.sub.e being calculated from a plateau modulus determined by rheological methods.

An acrylic pressure-sensitive adhesive (PSA) includes an acrylic polymer produced by free radical polymerization, having a weight-average molecular weight (M.sub.w) of less than 830 kDa; a relative peak width at half height (PWHH) of the acrylic polymer is 1.75 or less or, the acrylic polymer has an entanglement molecular weight (M.sub.e) of less than 50 kg/mol, the relative PWHH of the acrylic polymer being the ratio of an absolute PWHH of the acrylic polymer determined from differentiated DSC signal of the acrylic polymer at glass transition temperature (T.sub.g) to an absolute PWHH of a reference acrylic polymer obtained by reacting ethyl acrylate and acrylic acid in a weight ratio of 100:5 with 10 mmol/l AIBN, wherein the absolute PWHH of the reference acrylic polymer is determined in the same manner as the absolute PWHH of the acrylic polymer, and M.sub.e being calculated from a plateau modulus determined by rheological methods.

Negative pressure wound dressings comprising pressure-sensitive adhesives with enhanced adhesion to wet surfaces, obtained from crosslinking a pre-adhesive composition comprising poly(meth)acrylate macromolecules that comprise a number-average molecular weight of from about 25000 to about 200000, and methods of using such dressings.

Negative pressure wound dressings comprising pressure-sensitive adhesives with enhanced adhesion to wet surfaces, obtained from crosslinking a pre-adhesive composition comprising poly(meth)acrylate macromolecules that comprise a number-average molecular weight of from about 25000 to about 200000, and methods of using such dressings.

The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.

The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.