To provide a double-sided adhesive tape that achieves both high adhesive force and excellent easy disassembly properties. The double-sided adhesive tape includes a first adhesive layer; an intermediate layer provided on the first adhesive layer and containing a pigment and a binder resin; a film-like substrate stacked directly on the intermediate layer; and a second adhesive layer provided on the film-like substrate, in which the content of the pigment is from 1 to 85 wt % based on the total mass of the intermediate layer.

An optically clear adhesive film includes at least one first adhesive layer and at least one second adhesive layer that are stacked. A modulus of each first adhesive layer is less than a modulus of each second adhesive layer, and a glass transition temperature of the first adhesive layer is less than a glass transition temperature of the second adhesive layer.

To provide a half-cut double-sided tape from a double-sided tape with a release-liner commercially available in the market by means of a simple process without contacting a cutter blade directly to an adhesive layer when making the half cuts in the half-cut process. The invention includes: a processing protection layer formation step of feeding a protect release paper tape having the release surface to the double-sided tape to form a processing protection layer on the double-sided tape with the release liner; a half-cut step of continuously performing half-cut together with the processing protection layer and the double-sided tape on the release liner while leaving only the release liner, and making a number of the double-sided tape pieces of proper length are held on the release liner; a half-cut double-sided tape winding step of winding the half-cut double-sided tape with the release liner while peeling off the processing protection layer. A cut trace has a fully cut region in the width direction of the double-sided tape on the release liner and a non-cut region in the width direction of the protect release paper tape, so that the peeling is facilitated.

An adhesive sheet is a thermally expandable and thermosetting adhesive sheet including a substrate and a first layer provided on at least one surface of the substrate. The first layer contains an adhesive portion having an adhesive composition and thermally expandable first particles contained within the adhesive composition, and second particles provided in the adhesive portion and having different materials from those of the first particles, and each of the second particles is larger than each of the first particles.

Polymeric films, which may be adhesive films, and display devices including such polymeric films, wherein a polymeric film includes: a first polymeric layer having two major surfaces, wherein the first polymeric layer includes a first polymeric matrix and particles. The first polymeric layer includes: a first polymeric matrix having a refractive index n.sub.1; and particles having a refractive index n.sub.2 uniformly dispersed within the first polymeric matrix; wherein the particles are present in an amount of less than 30 vol-%, based on the volume of the first polymeric layer, and have a particle size range of 400 nanometers (nm) to 3000 nm; and wherein n.sub.1 is different than n.sub.2.

The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

The invention provides a laminated body having an excellent adhesive force with respect to a low-polarity metal member in the presence of hot water. The laminated body contains a resin substrate; an easily adhesive layer provided on at least one surface of the resin substrate; and an adhesive resin layer provided on a surface of the easily adhesive layer on a side opposite to the resin substrate, wherein the adhesive resin layer contains a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and the laminated body is used for bonding a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.

A separation sheet includes a polymeric carrier layer, a first adhesive layer, a second adhesive layer, and optionally a first and a second release liner. A method for producing a separation sheet, a method for waterproofing a substrate, a waterproofed substrate, and a use of the separation sheet for bonding of roof membranes to roof substrates.