Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.

An adhesive film with excellent cuttability with respect to both a base layer and a surface layer or layers laminated thereon is provided, without significant formation of adhesive burrs in various shearing processes. The adhesive film includes a support member and an adhesive layer laminated on at least one side of the support member. The adhesive layer has a laminate structure having a base layer made of a resin-based adhesive and laminated on the surface of the support member and a surface layer made of a resin-based adhesive and laminated on the base layer. The base layer is non-directional and has lengthwise and widthwise shearing strengths of 2 g to 2000 g [200 mm/min, 25 mm] in the thickness range of 2 μm to 60 μm. The base layer has a shearing strength of 1.5 to 200 times the shearing strength of the surface layer.

Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa), (b) in contact with said substrate (Sa), a layer (Lb) of a composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of −10° C. or lower, and (c) in contact with said layer (Lb), a layer (Lc) of a composition (Cc) that comprises one or more acrylic polymer (POLc) that comprises 20% to 90% polymerized units of one or more high-aliphatic vinyl monomer, by weight based on the weight of said polymer (POLc). Also provided is a bonded article made by a process of contacting a substrate (Sd) with such a pressure sensitive adhesive article, wherein said substrate (Sd) is in contact with said layer (Lc).

An embodiment of the present invention provides an electrical steel sheet including: an upper adhesive layer positioned on an upper surface of an electrical steel sheet; and an lower adhesive layer positioned on a lower surface of the electrical steel sheet, wherein the upper adhesive layer has a pencil hardness of F or lower, and the lower adhesive layer has a pencil hardness of H or higher.

The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

An acrylic adhesive composition contains an acrylic copolymer (A), which includes an alkyl (meth)acrylate monomer (a1) having a linear and/or branched alkyl group having 6 to 10 carbon atoms and a nitrogen-containing monomer (a2) as polymer chain components of the acrylic copolymer (A), wherein an amount of change in the loss tangent (tan δ) in the range of 20° C. to 100° C. of the acrylic adhesive composition is 0.5 or less. An adhesive tape has at least one acrylic adhesive layer composed of the acrylic adhesive composition.

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

A kit for protecting a display screen of an electronic device having an in-screen fingerprint sensor is provided. The kit includes a screen protector at least partially formed from a transparent material and an interface coupler configured to be positioned between the screen protector and the display screen proximate the in-screen fingerprint sensor. The interface coupler includes a transparent carrier layer, a first adhesive layer, and a second adhesive layer. The first adhesive layer is positioned on a first surface of the transparent carrier layer and configured to be affixed to the display screen of the electronic device, the first adhesive layer comprising a silicone adhesive or a gel or a gel-like material. The second adhesive layer is positioned on a second surface of the transparent carrier layer and configured to be affixed to the screen protector.

A silicone pressure sensitive adhesive composition containing: (A) a polydiorganosiloxane gum having a number average molecular weight≥500,000 g/mol, where the polydiorganosiloxane gum is terminated with an aliphatically unsaturated group; (B) a polydiorganosiloxane polymer having a number average molecular weight≤100,000 g/mol and an aliphatically unsaturated group content of >0.13 weight %; where starting materials (A) and (B) are present in a weight ratio (B)/(A) of 0.4 to 1.6; (C) a polyorganosilicate resin having a number average molecular weight<4,000 g/mol, where starting materials (A), (B) and (C) are present in a weight ratio (C)/(B+A) of 1.4 to 2; (D) a polyorganohydrogensiloxane; where starting materials (A), (B), and (D) are present in amounts sufficient to provide a molar ratio of silicon bonded hydrogen atoms/silicon bonded aliphatically unsaturated groups (SiH/Vi ratio) of 4 to 30 in the composition; (E) a hydrosilylation reaction catalyst; (F) an anchorage additive; and (G) a solvent. It is suitable for use in protective films for ultrasonic fingerprint sensors in display devices.