Patent classifications
C11D3/2041
APE-free laundry emulsifier
A detergent emulsifier for laundry and other hard surface cleaning using an APE-free surfactant blend is disclosed. The emulsifier system is efficacious for removal of oily soils and greasy food removal. The compositions according to the invention include linear and branched fatty alcohol ethoxylates and ethoxylate propoxylate block copolymers. Methods of using the same are disclosed.
STRUCTURED WASHING AGENT OR CLEANING AGENT WITH A FLOW LIMIT
A structured liquid washing agent or cleaning agent with a flow limit, containing a surfactant system of anionic surfactants, nonionic surfactants and co-surfactants, inorganic salt and an amphiphilic compound, as well as a washing method in which the washing agent or cleaning according to the invention is used, and corresponding uses.
CLEANING COMPOSITIONS
The present disclosure is directed to non-corrosive cleaning compositions that are useful, e.g., for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.
AMIDES OF ALIPHATIC POLYAMINES AND 12-HYDROXYOCTADECANOIC ACID AND LIPASE STABLE THICKENER COMPOSITIONS
Amides of an aliphatic polyamine with two or three molecules of 12-hydroxyoctadecanoic acid, wherein the polyamine comprises at least one primary amino group for each molecule of 12-hydroxyoctadecanoic acid and additionally at least one secondary and/or tertiary amino group, can be used in a lipase stable thickener composition comprising from 50 to 95% by weight of one or more of the amides, from 5 to 50% by weight of one or more diluents and from 0 to 10% by weight water, and such thickener compositions can be prepared by a step of heating a starting mixture comprising hydrogenated castor oil and one or more aliphatic polyamines and adding one or more diluents before or after the heating step.
METHOD FOR REDUCING GELLING BETWEEN A LIQUID LAUNDRY DETERGENT AND A LIQUID FABRIC ENHANCER
A method is provided for reducing undesired gelling between a liquid laundry detergent and a liquid fabric enhancer inside an automatic laundry washing machine, by employing, in combination, liquid laundry detergent and liquid fabric enhancer of specific compositional characteristics. Laundry cleaning system and fabric cleaning kit that promote the combined use of such liquid laundry detergent and such liquid fabric enhancer.
Home care composition comprising a mixed hydrophobically modified cationic polysaccharide
The presently disclosed and/or claimed inventive concept(s) relates to a liquid home care composition comprising a mixed hydrophobically modified cationic polysaccharide comprising a polysaccharide backbone having at least one cationic group, at least one C.sub.3-C.sub.8 short chain hydrophobic group and at least one C.sub.9-C.sub.24 long chain hydrophobic group attached thereon; at least one surfactants, and at least one additive agent used on the liquid home care composition. The liquid home care composition is a single clear, transparent liquid.
LAUNDRY DETERGENT COMPOSITIONS
A laundry detergent composition including an alkyl isethionate and a de-foaming agent.
Cleaning and disinfecting composition
The disclosed invention relates to a two-part liquid composition for cleaning and disinfecting a substrate, comprising: (A) a disinfectant medium comprising peracetic acid; and (B) a supplemental medium comprising a non-enzymatic cleaner, a corrosion inhibitor, and a chelator. The supplemental medium (B) may further comprise an enzymatic cleaner, a surfactant, a buffer, a pH modifier, or a mixture of two or more thereof. The substrate may be a medical device, for example, an endoscope.
Post-CMP removal using compositions and method of use
An amine-free composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The amine-free composition preferably includes at least one oxidizing agent, at least one complexing agent, at least one basic compound, and water and has a pH in the range from about 2.5 to about 11.5. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
SOLVENT CONTAINING HARD SURFACE CLEANING COMPOSITIONS
The need for a fast acting and broad spectrum antimicrobial composition which does not reduce surface shine and does not leave visible residues on the surface, which is also preferably suitable for surfaces which contact food, is met by formulating the hard surface cleaning compositions described herein.