Patent classifications
C11D7/505
Compositions comprising 1,1-difluoroethene (R-1132A)
The invention provides a composition comprising 1,1-difluoroethene (R-1132a); a second component selected from the group consisting of hexafluoroethane (R-116), ethane (R-170) and mixtures thereof; and, optionally carbon dioxide (CO.sub.2, R-744).
CLEANING SOLVENT COMPOSITIONS EXHIBITING AZEOTROPE-LIKE BEHAVIOR AND THEIR USE
A cleaning solvent composition comprises from about 70 to about 95.7 weight percent trans-dichloroethylene, from about 15 to about 3.8 weight percent heptafluorocyclopentane, and from about 15 to about 0.5 weight percent of methylperfluoroheptene ethers. The composition may comprise from about 88 to about 94.2 weight percent trans-dichloroethylene, from about 6 to about 3.8 weight percent heptafluorocyclopentane, and from about 6 to about 2 weight percent of methylperfluoroheptene ethers. A method for cleaning articles of soiling substances comprises contacting the articles with the solvent composition by any suitable means such as a spray delivered by a propellant gas, or by contact with liquid and/or vapor solvent compositions, as in a conventional vapor degreaser apparatus
COMPOSITIONS
A composition comprising: (i) 1,1-difluoroethene (vinylidene fluoride, R-1132a); (ii) carbon dioxide (CO.sub.2, R-744); (iii) pentafluoroethane (R-125); and (iv) one or more of trifluoromethane (R-23) and hexafluoroethane (R-116).
Compositions comprising 1,1-difluoroethene (R-1132A)
The invention provides a composition comprising 1,1-difluoroethene (R-1132a); a second component selected from the group consisting of hexafluoroethane (R-116), ethane (R-170) and mixtures thereof; and, optionally carbon dioxide (CO.sub.2, R-744).
COMPOSITIONS COMPRISING 1,1-DIFLUOROETHENE (R-1132A)
The invention provides a composition comprising 1,1-difluoroethene (R-1132a); a second component selected from the group consisting of hexafluoroethane (R-116), ethane (R-170) and mixtures thereof; and, optionally carbon dioxide (CO.sub.2, R-744).
COMPOSITIONS COMPRISING 1,1-DIFLUOROETHENE (R-1132A)
The invention provides a composition comprising 1,1-difluoroethene (R-1132a); a second component selected from the group consisting of hexafluoroethane (R-116), ethane (R-170) and mixtures thereof; and, optionally carbon dioxide (CO.sub.2, R-744).
Compositions comprising 1,1-difluoroethene (R-1132A)
The invention provides a composition comprising 1,1-difluoroethene (R-1132a); a second component selected from the group consisting of hexafluoroethane (R-116), ethane (R-170) and mixtures thereof; and, optionally carbon dioxide (CO.sub.2, R-744).
Azeotropic and Azeotrope-Like Compositions Comprising Z-1,1,1,4,4,4-Hexafluoro-2-Butene and Methyl PERFLUOROPROPYL ETHER
Disclosed are azeotropic or azeotrope-like compositions containing Z-1,1,1,4,4,4-hexafluoro-2-butene and methyl perfluoropropyl ether. Also disclosed is process of using the azeotropic or azeotrope-like composition as blowing agents for preparing a thermoplastic or thermoset foam. Also disclosed is a process of using the azeotropic or azeotrope-like composition as a refrigerant for producing cooling or heating. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as solvents. Also disclosed is a process of using the azeotropic or azeotrope-like composition as propellants for producing an aerosol. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as heat transfer media. Also disclosed is a process of extinguishing or suppressing a fire by using such azeotropic or azeotrope-like compositions. Also disclosed is a process of using such azeotropic or azeotrope-like compositions as dielectrics.
Selective removal of carbon-containing and nitrogen-containing silicon residues
A semi-aqueous wet clean system and method for removing carbon-containing silicon material (e.g., plasma residue) or nitrogen-containing silicon material (e.g., plasma residue) includes a hydroxyl-terminated organic compound, a diol, and a fluoride ion donor material. The system is configured to protect silicon oxide and amorphous silicon during a post-dry-etch wet clean. The wet clean system is configured to selectively remove carbon-containing or nitrogen-containing plasma residue. pH of the wet clean system can be modified to tune selectivity for removal of carbon-containing or nitrogen-containing plasma residues. As a result, positive TEOS recession of less than about 3 nanometers may be achieved. Additionally, the wet clean system can be adapted for reclamation and subsequent reuse.
Azeotrope-Like Compositions of Tetrafluoropropene And Hydrofluorocarbons
Provided are azeotrope-like compositions comprising tetrafluoropropene and hydrofluorocarbons and uses thereof, including use in refrigerant compositions, refrigeration systems, blowing agent compositions, and aerosol propellants.