The present invention relates to a method of forming a coating layer having plasma resistance, the method comprising steps of: preparing a substrate by placing the substrate in a substrate fixing device inside a process chamber; evaporating a Y.sub.2O.sub.3 deposition material provided in a solid form in an electron beam source by irradiating an electron beam on the Y.sub.2O.sub.3 deposition material; generating radical particles having activation energy by injecting a process gas containing oxygen for forming radicals into a RF energy beam source; irradiating an RF energy beam including the radical particles generated in the RF energy beam source, toward the substrate; depositing a thin film in which the evaporated deposition material is deposited on the substrate by being assisted by the RF energy beam, and densifying the thin film in which the deposition material deposited on the substrate forms a densified film by ion bombardment of the RF energy beam.

The present invention relates to a method of forming a coating layer having plasma resistance, the method comprising steps of: preparing a substrate by placing the substrate in a substrate fixing device inside a process chamber; evaporating a Y.sub.2O.sub.3 deposition material provided in a solid form in an electron beam source by irradiating an electron beam on the Y.sub.2O.sub.3 deposition material; generating radical particles having activation energy by injecting a process gas containing oxygen for forming radicals into a RF energy beam source; irradiating an RF energy beam including the radical particles generated in the RF energy beam source, toward the substrate; depositing a thin film in which the evaporated deposition material is deposited on the substrate by being assisted by the RF energy beam, and densifying the thin film in which the deposition material deposited on the substrate forms a densified film by ion bombardment of the RF energy beam.

A metallic nano-twinned thin film structure and a method for forming the same are provided. The metallic nano-twinned thin film structure includes a substrate, an adhesive-lattice-buffer layer over the substrate, and a single-layer or multi-layer metallic nano-twinned thin film over the adhesive-lattice-buffer layer. The metallic nano-twinned thin film includes parallel-arranged twin boundaries (Σ3+Σ9). In a cross-sectional view of the metallic nano-twinned thin film, the parallel-arranged twin boundaries account for 30% to 90% of total twin boundaries. The parallel-arranged twin boundaries include 80% to 99% of crystal orientation [111]. The single-layer metallic nano-twinned thin film includes copper, gold, palladium or nickel. The multi-layer metallic nano-twinned thin films are respectively composed of silver, copper, gold, palladium or nickel.

A transparent electrode is provided having a graphene conducting layer disposed above a substrate, a field effect control layer formed by using a transparent material, and a dielectric layer disposed between the graphene conducting layer and the field effect control layer, wherein the field effect control layer has a polarity charge in a working state. A sheet resistance of the transparent electrode is reduced.

A transparent electrode is provided having a graphene conducting layer disposed above a substrate, a field effect control layer formed by using a transparent material, and a dielectric layer disposed between the graphene conducting layer and the field effect control layer, wherein the field effect control layer has a polarity charge in a working state. A sheet resistance of the transparent electrode is reduced.

An article comprises a body having a protective coating. The protective coating is a thin film that comprises a metal oxy-fluoride. The metal oxy-fluoride has an empirical formula of M.sub.xO.sub.yF.sub.z, where M is a metal, y has a value of 0.1 to 1.9 times a value of x and z has a value of 0.1 to 3.9 times the value of x. The protective coating has a thickness of 1 to 30 microns and a porosity of less than 0.1%.

The present invention relates to a method of forming a coating layer of which a composition can be controlled, the method comprising steps of: preparing a substrate inside a chamber; evaporating a deposition material to generate YF.sub.3 or YOF particles in a gas phase by irradiating an electron beam on a YF.sub.3 deposition material provided in a solid form in an electron beam source; generating radical particles having activation energy by injecting a process gas containing oxygen into a RF energy beam source; irradiating an RF energy beam including oxygen radical particles toward the substrate; controlling a composition of a thin film by generating YOF deposition particles having a modified atomic ratio by adjusting an amount of fluorine substitution by oxygen as the YF.sub.3 or YOF particles and the oxygen radical particles react, and depositing the YOF deposition particles on the substrate with the RF energy beam.

Thermal barrier coatings consist of a tantala-zirconia mixture that is stabilized with two or more stabilizers. An exemplary thermal barrier coating consists of, by mole percent: about 8% to about 30% YO.sub.1.5; about 8% to about 30% YbO.sub.1.5 or GdO.sub.1.5 or combination thereof; about 8% to about 30% TaO.sub.2.5; about 0% to about 10% HfO.sub.2; and a balance of ZrO.sub.2.

Thermal barrier coatings consist of a tantala-zirconia mixture that is stabilized with two or more stabilizers. An exemplary thermal barrier coating consists of, by mole percent: about 8% to about 30% YO.sub.1.5; about 8% to about 30% YbO.sub.1.5 or GdO.sub.1.5 or combination thereof; about 8% to about 30% TaO.sub.2.5; about 0% to about 10% HfO.sub.2; and a balance of ZrO.sub.2.

Article comprising a polymeric substrate having a first major surface comprising a plurality of particles attached thereto with plasmonic material on the particles. Articles described herein are useful, for example, for indicating the presence, or even the quantity, of an analyte.