The present disclosure provides methods for forming a metal containing material onto a substrate with good film uniformity and stress profile across the substrate. In one embodiment, a method of sputter depositing a metal containing layer on a substrate includes supplying a gas mixture into a processing chamber, forming a first portion of a metal containing layer on a substrate, transferring the substrate from the processing chamber, rotating the substrate, transferring the substrate back to the processing chamber, and forming a second portion of the metal containing layer on the first portion of the metal containing layer.

Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are a 3D mapping device that is configured to measure the surface profile of a non-round substrate and a position of the substrate on the robot arm.

Embodiments of link chamber for use in multi-chamber processing tools or systems are provided herein. In some embodiments, a link chamber for use in a multi-chamber processing tool includes: a link chamber body having a plurality of facets extending between a bottom plate and a top plate, wherein at least seven of the plurality of facets have a chamber opening to form a plurality of chamber openings, wherein the plurality of chamber openings are sized to pass a substrate therethrough, and wherein each of the plurality of chamber openings are configured to be coupled to a slit valve, a load lock chamber, a cover plate, a process chamber, or a second link chamber body.

A coating installation for coating a spectacle lens is proposed. Preferably, the coating installation comprises a handling system for the automated handling of clamping rings for temporarily holding the spectacle lens during the application of the coating. In particular, the handling system is designed for automated transfer of spectacle lenses between different apparatuses of the coating installation. Furthermore, a clamping ring for clamping a spectacle lens at the edge, a magazine for storing clamping rings, a processing installation for processing spectacle lenses and several methods for processing and/or coating spectacle lenses are proposed.

With respect to a substrate processing method performed by a substrate processing apparatus including a vacuum chamber, a stage disposed in the vacuum chamber and including a heater, a gas supply that supplies a gas into the vacuum chamber, an exhaust device that exhaust the gas in the vacuum chamber, and an electrode installed in the vacuum chamber, the electrode being connected to the stage and applying a voltage to the heater, the substrate processing method includes performing a discharge countermeasure process including lowering the voltage applied to the heater while a pressure in the vacuum chamber is within a discharge pressure range, the discharge pressure range being determined based on Paschen's law as a pressure range in which discharge occurs in the vacuum chamber, and applying the voltage to the heater in response to determining that the pressure in the vacuum chamber is out of the discharge pressure range.

A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.

A film forming system for forming a magnetic film is provided. The film forming system includes a processing module configured to form the magnetic film on a substrate, a magnetization characteristic measuring device configured to measure magnetization characteristics of the magnetic film formed on the substrate in the processing module, and a transfer unit configured to transfer the substrate between the processing module and the magnetization characteristic measuring device. The magnetization characteristic measuring device includes a magnetic field applying mechanism having a permanent magnet magnetic circuit configured to apply a magnetic field to the substrate and adjust the magnetic field to be applied to the substrate, and a detector configured to detect magnetization characteristics of the substrate.

The present disclosure provides a substrate processing apparatus including at least one input/output chamber. The load lock device includes a base, a guide rail, a platform and an optical measuring module. The guide rail is connected to the base. The platform, carrying a cassette for holding a batch of spaced substrates, is movably disposed on the guide rail. The optical measuring module is configured to acquire an actual moving distance traveled by the platform along the guide rail based on at least one optical signal reflected from the platform.

A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a first transportation track within the vacuum chamber, the first transportation track having a first support structure and a first driving structure and defining a transportation direction; an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has a first pair of two slit openings, particularly essentially vertical slit openings, at opposing side walls of the vacuum chamber in the transportation direction; and a second transportation track within the vacuum chamber, the second transportation track having a second support structure and a second driving structure extending along the transportation direction, the vacuum chamber has a second pair of two slit openings at the opposing side walls of the vacuum chamber.

Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.