Patent classifications
C23C16/342
METHODS FOR DEPOSITING GAP FILING FLUIDS AND RELATED SYSTEMS AND DEVICES
Methods and systems for manufacturing a structure comprising a substrate. The substrate comprises plurality of recesses. The recesses are at least partially filled with a gap filling fluid. The gap filling fluid comprises boron, nitrogen, and hydrogen.
Thermally conductive and protective coating for electronic device
A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.
ATOMIC PRECISION CONTROL OF WAFER-SCALE TWO-DIMENSIONAL MATERIALS
Embodiments of this disclosure include apparatus, systems, and methods for fabricating monolayers. In one example, a method includes forming a multilayer film having a plurality of monolayers of a two-dimensional (2D) material on a growth substrate. The multilayer film has a first side proximate the growth substrate and a second side opposite the first side.
Method of forming boron-based film, and film forming apparatus
A method of forming a boron-based film includes forming the boron-based film mainly containing boron on a substrate by plasma CVD using plasma of a processing gas including a boron-containing gas; and controlling film stress of the formed boron-based film by adjusting a process parameter.
Film formation apparatus and film formation method
A film formation apparatus is configured to supply mist of a solution to a surface of a substrate so as to grow a film on the surface of the substrate, and the film formation apparatus may include: a furnace configured to house the substrate so as to heat the substrate; and a mist supply apparatus configured to supply the mist of the solution to the furnace, in which the film formation apparatus includes a portion configured to be exposed to the mist, and at least a part of the portion of the film formation apparatus is constituted of a material comprising boron nitride.
Chemical vapor deposition process to build 3D foam-like structures
A chemical vapor deposition process comprising heating a porous metal template at a temperature range of 500 to 2000° C.; and passing a gas mixture comprising a carrier gas carrying along a vapor of an organometallic compound and at least one of a carbon precursor gas and a boron nitride precursor gas through the heated metal template is provided. The heating temperature causes the decomposition of the organometallic compound vapor into metal particles, the carbon precursor gas into graphene domains, and/or the boron nitride precursor gas into hexagonal-boron nitride domains. The graphene domains and/or the hexagonal-boron nitride domains nucleate and grow on the metal particles and the metal template to form a three-dimensional interconnected porous network of graphene and/or the hexagonal-boron nitride. A foam-like structure produced by a process as described above is also provided. A foam-like structure as described above for use in electrochemistry, solar cells, filler, thermal interface material, sensing or biological applications is further provided.
Coated tool
A coated tool has a substrate and a hard material coating deposited on the substrate. The hard material coating has a layer structure in the following order, starting from the substrate: a titanium nitride layer, a titanium boron nitride transition layer, and a titanium diboride layer. The titanium boron nitride transition layer has a boron content that increases from the titanium nitride layer in the direction of the titanium diboride layer. The boron content does not exceed 15 at %.
SYNTHESIS OF HEXAGONAL BORON NITRIDE FILMS AND TRANSFER METHOD
A method of producing hexagonal boron nitride by chemical vapour deposition on a substrate, the method comprising: (a) a step of heating the substrate at a first temperature for a first time; (b) a step of exposing the substrate to a precursor containing boron and a precursor containing nitrogen at a first partial pressure of the precursor(s) at a second temperature for a second time, wherein either a single precursor is used as the precursor containing boron and as the precursor containing nitrogen or different precursors are used as the precursor containing boron and the precursor containing nitrogen; (c) a step of heating the substrate at a third temperature for a third time without the precursor; and (d) a step of exposing the substrate to the precursors at a fourth temperature at a second partial pressure of the precursor(s) for a fourth time.
Transparent electrode with a composite layer of a graphene layer and nanoparticles
A transparent electrode with a transparent substrate and a composite layer disposed thereon, wherein the composite layer includes a graphene layer and a plurality of nanoparticles, wherein the nanoparticles are embedded in the graphene layer and extend through a thickness of the graphene layer, and wherein the plurality of nanoparticles are in direct contact with the transparent substrate and a gap is present between the graphene layer and the transparent substrate.
CONTINUOUS MULTIPLE TOW COATING REACTOR
A tow coating reactor system includes a reactor for receiving fiber tow, a wedge situated adjacent the reactor and configured to receive the tow at a tip end, such that as the tow moves across the wedge, the wedge spreads the tow into a plurality of sub-tows.