Described herein are nanostraw well insert apparatuses (e.g., devices and systems) that include nanotubes extending through and out of a membrane so that a material can pass through the membrane from a fluid reservoir depot and into a cell grown onto the nanotubes when electrical energy (e.g., electroporation energy) is applied. In particular, the device, systems and methods described herein may be adapted for cell growth viability and transfection efficiency (e.g., >70%). These apparatuses may be readily integratable into cell culturing processes for improved transfection efficiency, intracellular transport, and cell viability.

A method includes placing a semiconductor substrate in a deposition chamber, wherein the semiconductor substrate includes a trench, and performing an atomic layer deposition (ALD) process to deposit a dielectric material within the trench, including flowing a first precursor of the dielectric material into the deposition chamber as a gas phase; flowing a second precursor of the dielectric material into the deposition chamber as a gas phase; and controlling the pressure and temperature within the deposition chamber such that the second precursor condenses on surfaces within the trench as a liquid phase of the second precursor, wherein the liquid phase of the second precursor has capillarity.

[Object] To provide a barrier laminate that includes a multilayer substrate with high interlayer adhesiveness to an evaporated film and that has high gas barrier properties.

[Solution] A barrier laminate according to the present invention includes a multilayer substrate and an evaporated film, wherein the multilayer substrate includes at least a polypropylene resin layer and a surface coating layer, the polypropylene resin layer is subjected to a stretching process, the surface coating layer contains a resin material with a polar group, and the evaporated film is composed of an inorganic oxide.

Layered dielectric materials for use in controlling dielectric strength in microelectronic devices, especially as they relate to electrophoretic and electrowetting applications. Specifically, a combination of a first atomic layer deposition (ALD) step, a sputtering step, and a second ALD step result in a layer that is chemically robust and nearly pinhole free. The dielectric layer may be disposed on the transparent common electrode of an electrophoretic display or covering the pixelated backplane electrodes, or both.

A film forming method includes preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed, supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) described in the specification, causing the organic compound to be selectively adsorbed in the first region among the first region and the second region, and cleaving the triple bond in the first region and forming a hydrophobic film having a honeycomb structure of carbon atoms through polymerization.

A coated tool of the present disclosure is provided with a base member and a coating layer located on a surface of the base member. The coating layer includes a TiCNO layer and an Al.sub.2O.sub.3 layer. The Al.sub.2O.sub.3 layer is located in contact with the TiCNO layer at a position farther from the base member than the TiCNO layer is. The TiCNO layer includes a composite protrusion including a first protrusion that projects toward the Al.sub.2O.sub.3 layer, a second protrusion that projects from the first protrusion in a direction intersecting a direction in which the first protrusion projects, and a third protrusion that projects from the second protrusion in a direction intersecting the direction in which the second protrusion projects.

Embodiments of the present disclosure generally relate to protective coatings on various substrates including aerospace components and methods for depositing the protective coatings. In one or more embodiments, a method of forming a protective coating on an aerospace component includes forming an aluminum oxide layer on a surface of the aerospace component and depositing a boron nitride layer on or over the aluminum oxide layer during a vapor deposition process. In some examples, the method includes depositing a metal-containing catalytic layer on the aluminum oxide layer before depositing the boron nitride layer. The boron nitride layer can include hexagonal boron nitride (hBN).

The invention is related to a soft-magnetic powder comprising coated particles, the coated particles comprising a core and a shell, the core having an average particle size D.sub.50 in a range from 0.1 μm to 100 μm and comprising iron, wherein the shell has a thickness of not more than 20 nm and comprises at least two solid oxides and wherein the shell comprises at least three layers and the shell comprises more than one layers of a first solid oxide and at least one layer of a second solid oxide, wherein the more than one layers of the first solid oxide and the at least one layer of the second solid oxide are arranged in an alternating manner. The invention is further related to a process for the production of the soft-magnetic powder, a use of the soft-magnetic powder and an electronic component comprising the soft-magnetic powder.

Cathode composition including a core cathode body composed of nickel oxide crystallite particles and a surface cathode coating layer contacting and at least partially surrounding an outer surface of the core cathode body. The surface cathode coating layer includes one or more of a transition metal or post-transition metal oxide or fluoride and one or more of lanthanide row atoms having a concentration in a range from about 0.1 to 10 mol %, has a thickness in a range from about 0.5 to 30 nm, and has an amorphous, polycrystalline or composite amorphous/polycrystalline atomic structure. Method of manufacture including preparing a cathode composition includes forming a core cathode body composed of nickel oxide crystallite particles, and, forming by atomic layer deposition, a surface cathode coating layer contacting and at least partially surrounding an outer surface of the core cathode body.

A cutting tool includes: a substrate; a hard layer provided on the substrate; and a titanium carbonitride layer provided on the hard layer, wherein a thickness of the titanium carbonitride layer is more than or equal to 2 μm, a hardness of the titanium carbonitride layer at a room temperature is more than or equal to 35 GPa, and a Young's modulus of the titanium carbonitride layer at the room temperature is less than or equal to 650 GPa.