There is provided a plasma generating device that includes a first electrode connected to a high-frequency power supply, and a second electrode to be grounded, a buffer structure configured to form a buffer chamber that accommodates the first and second electrodes wherein the first electrode and the second electrode are alternately arranged such that a number of electrodes of the first electrode and the second electrode are in an odd number of three or more in total, and wherein the second electrode is used in common for two of the first electrode being respectively adjacent to the second electrode used in common, and wherein a gas supply port that supplies gas into a process chamber is installed on a wall surface of the buffer structure.

There is provided a plasma generating device that includes a first electrode connected to a high-frequency power supply, and a second electrode to be grounded, a buffer structure configured to form a buffer chamber that accommodates the first and second electrodes wherein the first electrode and the second electrode are alternately arranged such that a number of electrodes of the first electrode and the second electrode are in an odd number of three or more in total, and wherein the second electrode is used in common for two of the first electrode being respectively adjacent to the second electrode used in common, and wherein a gas supply port that supplies gas into a process chamber is installed on a wall surface of the buffer structure.

A plasma processing apparatus includes a stage provided in a processing container, and an upper electrode. The upper electrode includes a dielectric plate facing the stage, and a conductor formed on a surface of the dielectric plate opposite to a surface of the dielectric plate facing the stage. The dielectric plate includes a central portion, an outer peripheral portion, and an intermediate portion between the central portion and the outer peripheral portion. The intermediate portion has a thickness larger than the thicknesses of the central portion and the outer peripheral portion.

A plasma processing apparatus includes a stage provided in a processing container, and an upper electrode. The upper electrode includes a dielectric plate facing the stage, and a conductor formed on a surface of the dielectric plate opposite to a surface of the dielectric plate facing the stage. The dielectric plate includes a central portion, an outer peripheral portion, and an intermediate portion between the central portion and the outer peripheral portion. The intermediate portion has a thickness larger than the thicknesses of the central portion and the outer peripheral portion.

A plasma processing apparatus is provided. The plasma processing apparatus is provided with an upper electrode, a lower electrode, and an electromagnetic wave emission port. The upper electrode is provided so as to allow discharging a processing gas into a processing container. The lower electrode is provided so as to holding a workpiece in the processing container. The electromagnetic wave emission port is provided at a height position between a height position of the upper electrode and a height position of the lower electrode, and is open toward a center of the processing container.

A plasma processing apparatus is provided. The plasma processing apparatus is provided with an upper electrode, a lower electrode, and an electromagnetic wave emission port. The upper electrode is provided so as to allow discharging a processing gas into a processing container. The lower electrode is provided so as to holding a workpiece in the processing container. The electromagnetic wave emission port is provided at a height position between a height position of the upper electrode and a height position of the lower electrode, and is open toward a center of the processing container.

Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.

Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.

An ignition control method is performed in a film forming apparatus including: a processing container that accommodates a substrate; a plasma box; a pair of electrodes disposed in the processing container to sandwich the plasma box; and a radio-frequency (RF) power supply connected to the pair of electrodes via a matching box. The ignition control method includes: (a) setting a process type that specifies a processing condition of the substrate; (b) measuring first information indicating a voltage between the pair of electrodes for each of a plurality of adjustment positions of the variable capacitor; (c) determining a preset value of the variable capacitor based on the first information measured in (b); and (d) setting an initial position of each of the plurality of adjustment positions of the variable capacitor to the preset value determined in (c).

An ignition control method is performed in a film forming apparatus including: a processing container that accommodates a substrate; a plasma box; a pair of electrodes disposed in the processing container to sandwich the plasma box; and a radio-frequency (RF) power supply connected to the pair of electrodes via a matching box. The ignition control method includes: (a) setting a process type that specifies a processing condition of the substrate; (b) measuring first information indicating a voltage between the pair of electrodes for each of a plurality of adjustment positions of the variable capacitor; (c) determining a preset value of the variable capacitor based on the first information measured in (b); and (d) setting an initial position of each of the plurality of adjustment positions of the variable capacitor to the preset value determined in (c).