A multilayer structure including a substrate and a first stack of a layer of SiO.sub.2 and a layer of material of the SiO.sub.xN.sub.yH.sub.z type positioned between the substrate and the layer of SiO.sub.2, in which the layer of SiO.sub.2 and the layer of material of the SiO.sub.xN.sub.yH.sub.z type have thicknesses (e.sub.B, e.sub.A) such that the thickness of the layer of SiO.sub.2 is less than or equal to 60 nm, the thickness of the layer of material of the SiO.sub.xN.sub.yH.sub.z type (e.sub.B) is more than twice the thickness (e.sub.A) of the layer of SiO.sub.2, and the sum of the thicknesses of the layer of SiO.sub.2 and of the layer of material of the SiO.sub.xN.sub.yH.sub.z type is between 100 nm and 500 nm, and in which z is strictly less than the ratio (x+y)/5, and advantageously z is strictly less than the ratio (x+y)/10.

The present invention relates to a method of manufacturing coated carbon nanotubes, the method comprising the steps of: functionalizing the carbon nanotubes in a solvent comprising a silane polymer; coating the carbon nanotubes with a SiO.sub.2 layer; depositing metal catalyst particles on the SiO.sub.2 layer of the carbon nanotubes; and performing electroless plating to form an Ag coating on the SiO.sub.2 layer of the carbon nanotubes. The invention also relates Ag-coated CNTs, and to the use of Ag-coated CNTs as interconnects in a flexible electronic film.

An advantageous method for treating the surface of a metallic substrate made of aluminum or an aluminum alloy, comprising the following steps: providing a water-based mixture with a sol, comprising alkoxy silanes of general chemical formula Si(OR).sub.4 and organoalkoxy silanes of general chemical formula R″Si(OR′).sub.3, in which R and R′ are linear or branched, short-chained hydrocarbon groups with at least one hydroxyl group and R″ is an organic group with a glycidoxy-, merkapto-, amino-, methacryl-, allyl- and/or vinyl-group, applying the mixture to the surface of the metallic substrate and at least in sections, hardening the mixture with a formation of a sol-gel coating connected to the metallic substrate.

A method of forming a cured film on an aluminum substrate includes depositing a film formed from a sol-gel coating composition onto the aluminum substrate without disposing a conversion coating composition onto the aluminum substrate. The method also includes, after depositing, curing the film. A coating system includes an aluminum substrate having a surface and a cured film disposed on and in contact with the surface. The cured film is formed from a sol-gel coating composition. The coating system is free from a layer formed from a conversion coating composition.

Solid or liquid N—H free, C-free, and Si-rich perhydropolysilazane compositions comprising units having the following formula [—N(SiH.sub.3).sub.x(SiH.sub.2—).sub.y], wherein x=0, 1, or 2 and y=0, 1, or 2 when x+y=2; and x=0, 1 or 2 and y=1, 2, or 3 when x+y=3 are disclosed. Also disclosed are synthesis methods and applications for the same.

The present invention relates to a process for the preparation of a bi-layer coated steel substrate comprising an inner inorganic ceramic layer and an external sol-gel layer, or alternatively an inner sol-gel layer and an external inorganic ceramic layer and to the bi-layer coated steel substrate obtainable by this process.

Provided is a barrier film, comprising: a base layer; and an inorganic layer including Si, N, and O, wherein the inorganic layer has a thickness of 600 nm or less, and the film has a water vapor transmission rate of 0.5×10.sup.−3 g/m.sup.2.Math.day as measured under conditions of a temperature of 38° C. and 100% relative humidity. The barrier film has excellent barrier properties and optical properties and can be used for electronic products sensitive to moisture.

Provided is a barrier film comprising a base layer, and an inorganic layer including Si, N, and O, and including a first region and a second region, which have different elemental contents (atomic %) of Si, N, and O from each other as measured by XPS, wherein the film has a water vapor transmission rate of 5.0×10.sup.−4 g/m.sup.2.Math.day or less as measured under conditions of a temperature of 38° C. and 100% relative humidity after being stored at 85° C. and 85% relative humidity conditions for 250 hours, or wherein the inorganic layer has a compactness expressed through an etching rate of 0.17 nm/s in the thickness direction for an Ar ion etching condition to etch Ta.sub.2O.sub.5 at a rate of 0.09 nm/s. The barrier film has excellent barrier properties and optical properties and can be used for electronic products that are sensitive to moisture and the like.

Embodiments of the present disclosure provide a method of manufacturing a metal column using 3D printing technology. The method of manufacturing a metal column includes steps of: creasing a 3D-CAD design for printing the metal column; printing the metal column; pretreating the inner surface of a channel inside the metal column at low temperature; and coating the inner surface of the channel with a stationary phase so that the metal column is capable of separating a gas mixture into components.

Methods are provided for selectively depositing a material on a first surface of a substrate relative to a second, different surface of the substrate. The selectively deposited material can be, for example, a metal, metal oxide, or dielectric material.