An electroplatingly decorated component is made using an injection-molding process and is provided with symbols or a structure introduced into the surface of the component, the component being made of a plastic material that can be electroplated. A method produces a component of this type.

The filter 105 used in a cell trapping device includes a sheet-like body portion (base metal plating layer 5) containing nickel or copper as a main component and provided with a plurality of through-holes in the thickness direction; a palladium layer 7 containing palladium as a main component and covering the surface of the body portion; and a gold layer 8 containing gold as a main component and covering the surface of the palladium layer.

A metallic coating includes a first metal, a second metal, phosphorous, and graphene nanoparticles. The first metal may be nickel and the second metal may be a refractory metal, such as tungsten, rhenium, molybdenum, niobium, tantalum, or mixtures thereof. The metallic coating may have, by weight, 1.0% to 40.0% of refractory metal, 1.0% to 20.0% of phosphorous, 0.01% to 5.0% of the graphene nanoplatelets, and a remainder of the nickel.

According to the invention, there are provided a conductive film which has a mesh-like metal layer composed of metal thin wires and in which visual recognition of the metal thin wires is suppressed and the metal layer has excellent conductive characteristics, a touch panel sensor, and a touch panel. A conductive film according to the invention includes a substrate; a patterned to-be-plated layer which is disposed on the substrate in a mesh pattern and has a functional group interacting with a plating catalyst or a precursor thereof; and a mesh-like metal layer which is disposed on the patterned to-be-plated layer and has a plurality of metal thin wires intersecting each other, an average thickness of the patterned to-be-plated layer is 0.05 to 100 m, an average thickness of the metal layer is 0.05 to 0.5 m, and an average intersection growing rate at an intersection of metal thin wires of the mesh of the metal layer is 1.6 or less.

An electrical member comprises a housing and an electromagnetic shielding. The electromagnetic shielding is formed at least in sections by an electrically conductive coating on the housing.

According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a selectively plated roll of material includes a substrate, an electrically-conductive ink in a pattern along the substrate, and a metal plating on the electrically-conductive ink. The metal plating may be deposited on the electrically-conductive ink without over-plating the substrate whereat the electrically-conductive ink is not present.

Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.

In one aspect, the present disclosure provides a polymer film with a low glass transition temperature. In one embodiment, when in contact with a metal substrate, the polymer film adheres to the metal substrate under heating and/or mechanical pressure. In one embodiment, the polymer film comprises a butadiene copolymer and a butylene polymer. In another aspect, the present disclosure further provides a method of masking a metal substrate using the polymer film. In yet another aspect, the present disclosure provides a method of chemically or electrochemically processing a metal substrate that is masked with the polymer film.

A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

A transistor manufacturing method includes forming a source electrode and a drain electrode on a substrate, forming a layer including an insulator layer to cover the source electrode and the drain electrode, and forming a gate electrode on the layer including the insulator layer, wherein the forming the gate electrode includes forming a plating base film, forming a protection layer of the plating base film, forming a photoresist layer on the protection layer to expose the photoresist layer with desired patterning light, causing the exposed photoresist layer to come into contact with a developer to remove the photoresist layer and the protection layer until the plating base film is uncovered corresponding to the patterning light, and after depositing a metal on the uncovered plating base film, causing an electroless plating solution to come into contact with the plating base film to perform electroless plating.