A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 m thick having a surface having an arithmetic mean waviness Wa of 0.10 m or more and 0.25 m or less and a valley portion void volume Vvv of 0.010 m.sup.3/m.sup.2 or more and 0.028 m.sup.3/m.sup.2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

The disclosure is directed at methods of producing metals with texture surfaces. The metals may include metal nanoparticles, metal alloy nanoparticles, thin metal films, thin metal foils or extended metal surfaces. A selected metal is combined with an aqueous growth solution that may include a cationic surfactant solution and a metal salt to generate a reaction mixture. A pH of the reaction mixture may be adjusted before an ascorbic acid is added. After the ascorbic acid is added, the reaction mixture is left to react and then the resultant metal with a textured surface is collected.

Provided are methods for forming a circuit pattern on a substrate by a process for circuit pattern formation, such as a semi-additive process (SAP) or a modified semi-additive process (mSAP), using a thin metal foil with low surface roughness.

A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

A method for producing a corrosion resistant metal substrate and corrosion resistant metal substrate provided thereby. The method involves forming a plated substrate including a metal substrate provided with a nickel layer or with a nickel and cobalt layer followed by electrodepositing a molybdenum oxide layer from an aqueous solution onto the plated substrate, which is subsequently subjected to an annealing step in a reducing atmosphere to reduce the molybdenum oxide in the molybdenum oxide layer to molybdenum metal in a reduction annealing step and to form a diffusion layer which contains nickel and molybdenum, and optionally cobalt.

A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminum and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.

A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about 5 to about 5, and a coordinate b value of about 5 to about 5 in a CIELab color space.

Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

Implementations of the present disclosure relate to an improved shield for use in a processing chamber. In one implementation, the shield includes a hollow body having a cylindrical shape that is substantially symmetric about a central axis of the body, and a coating layer formed on an inner surface of the body. The coating layer is formed the same material as a sputtering target used in the processing chamber. The shield advantageously reduces particle contamination in films deposited using RF-PVD by reducing arcing between the shield and the sputtering target. Arcing is reduced by the presence of a coating layer on the interior surfaces of the shield.