A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

A sensor cover includes a substrate, and a silver particle layer provided on the substrate, the silver particle layer including a silver particle, in which the silver particle has an electromagnetic wave transmission layer on a surface thereof.

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30 C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

A process for the electroless deposition palladium on a substrate, the process comprising the steps of: (a) preparing the substrate to accept electroless palladium deposited thereon; and (b) bringing the substrate into contact with an electroless palladium composition, the electroless palladium composition comprising: (i) a source of palladium ions; (ii) one or more complexing agents; (iii) a reducing agent; and (iv) a plating rate enhancer, wherein the plating rate enhancer comprises a source of antimony ions.