A microstructure comprises a plurality of interconnected units wherein the units are formed of hexagonal boron nitride (h-BN) tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing an h-BN precursor on the metal microlattice, converting the h-BN precursor to h-BN, and removing the metal microlattice.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less and a valley portion void volume Vvv of 0.010 μm.sup.3/μm.sup.2 or more and 0.028 μm.sup.3/μm.sup.2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

There is provided a metal-coated Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire includes a core wire of Al or Al alloy, and a coating layer of Ag, Au or an alloy containing them formed on the outer periphery of the core wire, and the bonding wire is characterized in that when measuring crystal orientations on a cross-section of the core wire in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction. Preferably, the surface roughness of the wire is 2 μm or less in terms of Rz.

A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

A color coating layer is formed on the surface of a stainless steel plate by a chemical coloring method or an electrolytic coloring method. Thereafter, a colored stainless steel plate having the color coating layer is cold-rolled, the thickness of the color coating layer is adjusted to between 0.05 μm and 1.0 μm, and an entire plate thickness is adjusted to 0.5 mm or less. By the cold rolling a Vickers hardness Hv is between 250 and 550 to form a deformed band. As surface roughness, an arithmetic average roughness Ra is adjusted to between 0.05 μm and 5.0 μm. In this manner, the strength and rigidity of a thin colored stainless steel plate can be secured, and a color stainless steel plate and a colored stainless steel coil which do not easily cause galling and are excellent in press moldability can be obtained.

An aqueous electroless nickel plating bath for forming electroless nickel coatings includes nickel, a hypophosphorous reducing agent, zinc, a bismuth stabilizer, and at least one of a complexing agent, a chelating agent, or a pH buffer, and is free of a sulfur compound.

A piston ring for an engine may include a piston ring body. The piston ring body may include a working surface, a lower surface, an upper surface, and an inner surface. An area of the working surface and/or the lower surface which is close to an outer circumferential lower edge of the piston ring body is not provided with a nitride layer, the outer circumferential lower edge is formed with a chamfer, the chamfer does not have a nitride layer, and an additional area of the piston ring has a nitride layer.

A process for manufacturing an optical element comprising a first step of spinning a circular sheet of a first metallic material for it to adhere to a rotating matrix and form a shell; a second step of assembling the shell on a temporary support; and at least a third step of diamond turning the shell by means of a diamond tool to obtain an optical surface.