A system for performing electroless nickel plating on a portion of a metallic piece comprises a chamber fixedly coupled to the metallic piece during operation of the system so that the portion of the metallic piece and the chamber define a closed volume. The chamber has an inlet to supply at least a plating fluid into the volume and an outlet to discharge the plating fluid from the volume, so that the portion of the metallic piece is exposed to the plating fluid and is plated.

Disclosed herein is an aluminum oxide film remover for removing an oxide film on the surface of aluminum or aluminum alloy, which comprises silver ions and/or copper ions, a solubilizing agent for silver ions and/or copper ions, and a quaternary ammonium hydroxide compound, and has a pH value of 10 to 13.5. A method for surface treatment of aluminum or aluminum alloy is also disclosed, which comprises immersing a workpiece having aluminum or aluminum alloy at least on the surface thereof in the aluminum oxide film remover, and depositing the silver and/or copper contained in the remover on the surface of aluminum or aluminum alloy while removing the aluminum oxide film.

The invention relates to a method for removing a substrate that is coated with an organic coated coating by means of ionogenic gel formation. In said method, a wet or dry organic coating that has not yet formed a film on the substrate is treated with an aqueous solution of a metal salt from main group I in the periodic table of the elements, a complexing agent and/or a basic compound having a pH value>10.