It is an object to provide a technique for obtaining a wiring pattern by electroless plating without using a lift-off process. A method for manufacturing a wiring pattern characteristically includes: a base layer forming step of forming an base layer including a catalyst for electroless plating and a resin; a surface layer removing step of removing at least a part of a surface layer of the base layer; and a plating layer forming step of performing electroless plating and forming a plating layer on the base layer subjected to the surface layer removing step.

A latent heat storage material includes a latent heat storage member formed of an organic compound, and a metallic seamless capsule encapsulating the latent heat storage member. A method for manufacturing the latent heat storage material includes preparing a grain of the latent heat storage member, supporting a powder on the latent heat storage member, conducting an electroless plating to form a first plating layer of the metallic seamless capsule on a surface of the latent heat storage member, and conducting an electrolytic plating to form a second plating layer of the metallic seamless capsule on a surface of the first plating layer.

This application relates to a metal coating method for plastic outer part requiring robustness. In the metal coating method, first, provide a plastic outer part as a motion assistance tool. Thereafter, a cold plasma treatment is performed to introduce a polar functional group to a surface of the plastic outer part by treating the plastic outer part with cold plasma. Next, a metal coating layer is formed on the surface of the plastic outer part treated with the cold plasma by an electroless plating method. Thereafter, an adhesive strength improvement process of improving an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cm.sup.2 or more by heat treatment of the plastic outer part with the metal coating layer thereon is performed.

Proposed is a mobile device case that accommodates or covers a substrate and an electronic element located on the substrate. The case includes: a case frame made of a high molecular material including a resin and having a cover part for accommodating or covering the substrate and protrusions protruding from the cover part in such a manner as to be extended close to the electronic element; and a metal coating layer formed by coating a metal on a surface of the case frame including the protrusions to improve electromagnetic shielding ability.

There is provided with a method of manufacturing a resin product. The method includes preparing a resin substrate that is provided with, in a first portion on a surface of the resin substrate, a first patterned layer of a first material. The method also includes forming a second patterned layer of a second material in a second portion on the surface of the resin substrate, by irradiating the second portion with ultraviolet light and then subjecting the second portion to electroless plating.

A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

The present invention provides a surface-independent surface-modifying multifunctional biocoating and methods of application thereof. The method comprises contacting at least a portion of a substrate with an alkaline solution comprising a surface-modifying agent (SMA) such as dopamine so as to modify the substrate surface to include at least one reactive moiety. In another version of the invention, a secondary reactive moiety is applied to the SMA-treated substrate to yield a surface-modified substrate having a specific functionality.

There is provided with a method for manufacturing a resin article provided with a plating film. A resin article is irradiated with ultraviolet rays. A catalyst is applied to the resin article, while applying shock to the resin article that has been irradiated with the ultraviolet rays. An electroless plating is performed on the resin article.

A method including activating an area of a polymer layer on a substrate with electromagnetic radiation; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with the self-assembled monolayer; and reacting the self-assembled monolayer with a conductive material. A method including activating an area of a polymer dielectric layer on a substrate with electromagnetic radiation, the area selected for an electrically conductive line; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with a catalyst; and electroless plating a conductive material on the self-assembled monolayer.