An electrode for a lithium secondary battery, which may be applied to the lithium secondary battery to increase cycling performance and efficiency of the battery, and a manufacturing method thereof. When the electrode for the lithium secondary battery of the present invention is applied to the lithium secondary battery, uniform deposition and stripping of lithium metals occur throughout the surface of the electrode when charging/discharging the battery, thereby inhibiting uneven growth of lithium dendrites and improving cycle and efficiency characteristics of the battery. Further, the electrode for the lithium secondary battery of the present invention exhibits remarkably high flexibility, as compared with existing electrodes including a metal current collector and an active material layer, thereby improving processability during manufacture of the electrode and assembling the battery.

A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.

The invention relates to nickel-coated hexagonal boron nitride nanosheet composite powder, its preparation and high-performance composite ceramic cutting tool material. The composite powder has a core-shell structure with BNNS as the core and Ni as the shell. The self-lubricating ceramic cutting tool material is prepared by wet ball milling mixing and vacuum hot-pressing sintering with a phase alumina as the matrix, tungsten-titanium carbide as the reinforcing phase, nickel-coated hexagonal boron nitride nanosheet composite powder as the solid lubricant and magnesium oxide and yttrium oxide as the sintering aids. The invention also provides preparation methods of the nickel-coated hexagonal boron nitride nanosheet composite powder and the self-lubricating ceramic cutting tool material.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

A transistor manufacturing method includes forming a source electrode and a drain electrode on a substrate, forming a layer including an insulator layer to cover the source electrode and the drain electrode, and forming a gate electrode on the layer including the insulator layer, wherein the forming the gate electrode includes forming a plating base film, forming a protection layer of the plating base film, forming a photoresist layer on the protection layer to expose the photoresist layer with desired patterning light, causing the exposed photoresist layer to come into contact with a developer to remove the photoresist layer and the protection layer until the plating base film is uncovered corresponding to the patterning light, and after depositing a metal on the uncovered plating base film, causing an electroless plating solution to come into contact with the plating base film to perform electroless plating.

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.

The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.

The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.

Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of printed objects. Conductive traces and similar features may be introduced during additive manufacturing processes by incorporating a metal precursor in a thermoplastic printing composition, converting a portion of the metal precursor to discontinuous metal islands using laser irradiation, and performing electroless plating. Suitable printing compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer, a metal precursor admixed with the thermoplastic polymer, and optionally a plurality of nanoparticles disposed upon an outer surface of each of the thermoplastic particulates, wherein the metal precursor is activatable to form metal islands upon exposure to laser irradiation. Melt emulsification may be used to form the thermoplastic particulates.