The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin and surfactants. Activators of the invention are preferably employed for electroless copper deposition.

A conductive fabric filter includes a non-woven fabric coated with copper by electroless plating, and the non-woven fabric has pores and is conductive.

An electroless copper deposition composition, comprising: (a) a source of copper ions; (b) a chelator; (c) a source of alkalinity; (d) a reducing agent; (e) nickel ions; (f) a bipyridine; (g) optionally, an additional stabilizer; and (h) optionally, a water soluble polymer. The electroless copper deposition composition can be used to deposit a ductile copper deposit on a substrate that exhibits high % elongation and high tensile strength.

An electroless copper deposition composition, comprising: (a) a source of copper ions; (b) a chelator; (c) a source of alkalinity; (d) a reducing agent; (e) nickel ions; (f) a bipyridine; (g) optionally, an additional stabilizer; and (h) optionally, a water soluble polymer. The electroless copper deposition composition can be used to deposit a ductile copper deposit on a substrate that exhibits high % elongation and high tensile strength.

A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; an extrusion fluid sending device configured to send an extrusion fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.

The invention relates to selective deposition of a nickel layer on a copper surface. The invention may be used in the production of electrically conductive areas for electronic circuits. Method for nickel deposition on the surface of copper comprises immersing an item, which surface is to be deposited with the nickel layer, into one or more baths, of which at least one contains a reducing agent and of which at least one is adapted for (electroless) plating of nickel. In order to extend the field of application and to obtain practically pure nickel coatings, said reducing agent comprises boronic or phosphoric compounds, comprising morpholine borane (C.sub.4H.sub.9BNO), or dimethylamine borane (C.sub.2H.sub.7BN), or sodium tetrahydroborate (NaBH.sub.4), or sodium hypophosphite (NaH.sub.2PO.sub.2) and said reducing agent directly or indirectly reduces insoluble copper (I) or copper (II) compounds on the copper surface. At least one of the mention baths comprises a ligand or mixture thereof.

The invention relates to selective deposition of a nickel layer on a copper surface. The invention may be used in the production of electrically conductive areas for electronic circuits. Method for nickel deposition on the surface of copper comprises immersing an item, which surface is to be deposited with the nickel layer, into one or more baths, of which at least one contains a reducing agent and of which at least one is adapted for (electroless) plating of nickel. In order to extend the field of application and to obtain practically pure nickel coatings, said reducing agent comprises boronic or phosphoric compounds, comprising morpholine borane (C.sub.4H.sub.9BNO), or dimethylamine borane (C.sub.2H.sub.7BN), or sodium tetrahydroborate (NaBH.sub.4), or sodium hypophosphite (NaH.sub.2PO.sub.2) and said reducing agent directly or indirectly reduces insoluble copper (I) or copper (II) compounds on the copper surface. At least one of the mention baths comprises a ligand or mixture thereof.

A substitution gold plating solution for performing uniform gold plating directly on copper wiring of a printed circuit board is provided and a gold plating method using the same is provided, the solution comprising a purine-based compound or a pyrimidine-based compound having a carbonyl oxygen used as a localized corrosion inhibitor, a water-soluble gold compound, an aminocarboxylic acid as a complexing agent, a dicarboxylic acid as a conductivity improving agent, an α-hydroxycarboxylic acid and heteroaryl carboxylic acid as a base metal elution and reprecipitation preventing agent, a sulfite compound as a gold ion stabilizer, an axole compound as a surface corrosion inhibitor, other surfactants, crystal regulators, pH adjuster, and buffers. The substitution-type electroless gold plating solution according to the present invention prevents the localized corrosion of the copper surface, which is the base metal, and thus the gold plating film produced is excellent in solder mounting reliability.

The present invention relates to a composition in the form of sheet or layer comprising a layer of an aromatic polymer and a layer of metal adhering to at least one side of said polymeric sheet, and to its uses.

The present invention relates to a composition in the form of sheet or layer comprising a layer of an aromatic polymer and a layer of metal adhering to at least one side of said polymeric sheet, and to its uses.