Provided in the present invention are a flexible electrochemical electrode, a subcutaneous continuous glucose monitoring sensor equipped with the electrochemical electrode, and a preparation method thereof. The electrode directly uses gold layers on both sides of a chemically plated film, respectively as a working electrode and a reference-counter electrode, so as to form an electrochemical two-electrode system. Petaloid platinum nanoparticles are electrodeposited on a surface of the configured working electrode as a catalytic layer; a carbon nanotube/Nafion mesh layer functions as an anti-interference layer, and is formed thereon with an enzyme biochemical sensitive layer by means of electrostatic adsorption, after crosslinking and curing in glutaraldehyde, polyurethane mass transfer is coated to limit a protection layer, so as to prepare a flexible continuous glucose monitoring sensor. The sensor does not require photolithography, screen printing or other technologies to construct an electrochemical electrode system. The present invention effectively simplifies the processing technology, can easily achieve large-scale production and reduce production costs; and meanwhile, the present invention has characteristics such as a wide linear range, low detection limit, powerful anti-interference capacity, high response sensitivity and long-term stability.

Provided in the present invention are a flexible electrochemical electrode, a subcutaneous continuous glucose monitoring sensor equipped with the electrochemical electrode, and a preparation method thereof. The electrode directly uses gold layers on both sides of a chemically plated film, respectively as a working electrode and a reference-counter electrode, so as to form an electrochemical two-electrode system. Petaloid platinum nanoparticles are electrodeposited on a surface of the configured working electrode as a catalytic layer; a carbon nanotube/Nafion mesh layer functions as an anti-interference layer, and is formed thereon with an enzyme biochemical sensitive layer by means of electrostatic adsorption, after crosslinking and curing in glutaraldehyde, polyurethane mass transfer is coated to limit a protection layer, so as to prepare a flexible continuous glucose monitoring sensor. The sensor does not require photolithography, screen printing or other technologies to construct an electrochemical electrode system. The present invention effectively simplifies the processing technology, can easily achieve large-scale production and reduce production costs; and meanwhile, the present invention has characteristics such as a wide linear range, low detection limit, powerful anti-interference capacity, high response sensitivity and long-term stability.

The amount of a processing solution used is reduced, and the quality of an electroless plated fiber material is improved. The present invention relates to a manufacturing method for an electroless plated fiber material A4. The manufacturing method includes a step S5 of electrostatically spraying a solution B containing a catalyst precursor in a state of being electrically charged to a positive potential onto a fiber material A2 while grounding the fiber material A2 and moistening the fiber material A2, and electrostatically spraying a solution C containing a reducing agent in a state of being electrically charged to a positive potential onto the fiber material A2, and a step S7 of electrostatically spraying each of a solution D containing metal ions and a solution E containing a reducing agent each in a state of being electrically charged to a positive potential onto the fiber material A3 such that the solution D containing metal ions and the solution E containing the reducing agent react with each other in the same electric field on the fiber material A3 while grounding the fiber material A3 to which a catalyst is given and moistening the fiber material A3. The present invention relates to the electroless plated fiber material A4 manufactured by the manufacturing method. The present invention relates to a manufacturing system of the electroless plated fiber material A4.

The electroless gold plating bath includes a gold sulfate, a thiosulfate, ascorbic acid compounds, and hydrazine compounds, the hydrazine compounds being at least one selected from the group consisting of adipic dihydrazide, propionic hydrazide, hydrazine sulfate, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine carbonate, hydrazine monohydrate, sebacic dihydrazide, dodecanediohydrazide, isophthalic dihydrazide, hydrazide, 3-hydro-2-naphtboic hydrazide benzophenone hydrazone, phenylhydrazine, benzylhydrazine monohydrochloride, methylhydrazine sulfate, and isopropylhydrazine hydrochloride.

In the method for producing a plating stack, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of a third metal is deposited on the plating layer A, and then a plating layer C mainly composed of the second metal, the third metal, or a fourth metal is deposited on the plating layer B by a redox reaction. A concrete configuration of plating layers includes, for example, the plating layer A is gold, platinum or silver, the plating layer B is palladium, and the plating layer C is palladium.

A wiring board includes a substrate having main surfaces and an electrode containing Cu or Ag as a main component on at least one main surface of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film containing crystalline Ni as a main component, a surface of the first Ni film is covered by a second Ni film containing amorphous Ni as a main component, and the first Ni film covers a part of a first corner where a side surface of the electrode is in contact with the substrate.

A wiring board includes a substrate having main surfaces and an electrode containing Cu or Ag as a main component on at least one main surface of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film containing crystalline Ni as a main component, a surface of the first Ni film is covered by a second Ni film containing amorphous Ni as a main component, and the first Ni film covers a part of a first corner where a side surface of the electrode is in contact with the substrate.

A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.

A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.

The present invention relates to the use of water soluble lanthanide compounds as stabilizer in electrolytes for electroless metal deposition, an electrolyte as well as a method for the electroless deposition of metals, particularly layers of nickel, copper, cobalt, boron, silver, palladium or gold, as well as layers of alloys comprising at least one of the aforementioned metals as alloying metal.