Patent classifications
C23F1/20
ORGANIC CONTAMINATION FREE SURFACE MACHINING
A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.
Continuous coil pretreatment process
Described herein is a continuous coil pretreatment process used to treat the surface of an aluminum alloy sheet or coil for subsequent deposition of an acidic organophosphorus compound. The process can include applying a cleaner to a surface of an aluminum sheet or a coil; etching the surface of the aluminum sheet or the coil with an acidic solution; rinsing the surface of the aluminum sheet or the coil with deionized water; applying to the surface of the aluminum sheet or the coil a solution of an acidic organophosphorus compound; rinsing the surface of the aluminum sheet or the coil with deionized water; and drying the surface of the aluminum sheet or the coil.
Continuous coil pretreatment process
Described herein is a continuous coil pretreatment process used to treat the surface of an aluminum alloy sheet or coil for subsequent deposition of an acidic organophosphorus compound. The process can include applying a cleaner to a surface of an aluminum sheet or a coil; etching the surface of the aluminum sheet or the coil with an acidic solution; rinsing the surface of the aluminum sheet or the coil with deionized water; applying to the surface of the aluminum sheet or the coil a solution of an acidic organophosphorus compound; rinsing the surface of the aluminum sheet or the coil with deionized water; and drying the surface of the aluminum sheet or the coil.
Transforming a valve metal layer into a template comprising a plurality of spaced (nano)channels and forming spaced structures therein
At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.
Transforming a valve metal layer into a template comprising a plurality of spaced (nano)channels and forming spaced structures therein
At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.
METHOD OF FINISHING A METALLIC SURFACE
A method of finishing a metallic surface includes the steps of: disposing a mask layer onto an initial metallic surface of a substrate, etching at least a portion of the initial metallic surface with an etchant to provide an etched surface, and separating the etchant from the etched surface. The etched surface is smoother than the initial metallic surface. On a depth basis: the etchant etches said at least a portion of the mask layer and said at least a portion of the initial metallic surface at substantially the same rate; and/or the etchant penetrates said at least a portion of the mask layer and etches said at least a portion of the initial metallic surface at substantially the same rate. A substrate finished by the disclosed method and a kit for practicing the method are also disclosed.
METHOD OF FINISHING A METALLIC SURFACE
A method of finishing a metallic surface includes the steps of: disposing a mask layer onto an initial metallic surface of a substrate, etching at least a portion of the initial metallic surface with an etchant to provide an etched surface, and separating the etchant from the etched surface. The etched surface is smoother than the initial metallic surface. On a depth basis: the etchant etches said at least a portion of the mask layer and said at least a portion of the initial metallic surface at substantially the same rate; and/or the etchant penetrates said at least a portion of the mask layer and etches said at least a portion of the initial metallic surface at substantially the same rate. A substrate finished by the disclosed method and a kit for practicing the method are also disclosed.
PREPARATION METHOD, APPARATUS, AND DEVICE FOR COPLANAR WAVEGUIDE STRUCTURE, AND SUPERCONDUCTING DEVICE
A method for preparing a coplanar waveguide structure includes acquiring a structure to be etched, the structure to be etched including an aluminum film provided on a substrate structure and a photoresist structure provided at an upper end of the aluminum film, wherein the photoresist structure is configured to cover partial areas of the aluminum film; performing a first etching operation on the aluminum film provided on the substrate structure by using an acidic solution to obtain a first etched structure; rinsing the first etched structure to obtain an intermediate structure; performing a second etching operation on the intermediate structure by using an alkaline solution to obtain a second etched structure; and rinsing the second etched structure to obtain a target structure for generating a coplanar waveguide structure, the target structure including the aluminum film and the photoresist structure, wherein the photoresist structure covers all areas of the aluminum film.
PREPARATION METHOD, APPARATUS, AND DEVICE FOR COPLANAR WAVEGUIDE STRUCTURE, AND SUPERCONDUCTING DEVICE
A method for preparing a coplanar waveguide structure includes acquiring a structure to be etched, the structure to be etched including an aluminum film provided on a substrate structure and a photoresist structure provided at an upper end of the aluminum film, wherein the photoresist structure is configured to cover partial areas of the aluminum film; performing a first etching operation on the aluminum film provided on the substrate structure by using an acidic solution to obtain a first etched structure; rinsing the first etched structure to obtain an intermediate structure; performing a second etching operation on the intermediate structure by using an alkaline solution to obtain a second etched structure; and rinsing the second etched structure to obtain a target structure for generating a coplanar waveguide structure, the target structure including the aluminum film and the photoresist structure, wherein the photoresist structure covers all areas of the aluminum film.
TITANIUM ALLOY PRODUCT, HOUSING, AND METHOD FOR MANUFACTURING THE SAME
A titanium alloy product includes a titanium alloy substrate and a plurality of first holes defined in a surface of the titanium alloy substrate. The first holes have an opening on the surface of the titanium alloy substrate and an inner wall connecting with the opening, a diameter of the inner space is greater than a diameter of the opening. The product tensile strength of bonding between the titanium alloy product and a material part filled in the first holes is very high. A housing with the titanium alloy product and a method for manufacturing the titanium alloy product are also disclosed.