A surface of an article is modified by aluminizing an initial surface at a first temperature to form a first aluminized layer and a sublayer, removing at least a portion of the first aluminized layer, aluminizing the sublayer at a second temperature to form a second aluminized layer, and finally removing at least a portion of the second aluminized layer to form a processed surface. The second temperature is less than the first temperature and a roughness of the processed surface is less than the roughness of the initial surface.

A surface of an article is modified by aluminizing an initial surface at a first temperature to form a first aluminized layer and a sublayer, removing at least a portion of the first aluminized layer, aluminizing the sublayer at a second temperature to form a second aluminized layer, and finally removing at least a portion of the second aluminized layer to form a processed surface. The second temperature is less than the first temperature and a roughness of the processed surface is less than the roughness of the initial surface.

A method for etching fragments of aluminum or an aluminum alloy comprising the steps of: a. providing a hydrochloric acid solution in a trough-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving an amount of aluminum to produce an etching solution; c. adding the fragments to the etching solution immediately after the inoculation; d. etching the fragments for 0.5 to 10 minutes while stirring in such a way that the fragments are entrained by the motion of the etching solution; e. stopping the etching by diluting the etching solution with water; f. removing the etched fragments; g. repeatedly rinsing the fragments with water and h. rinsing the fragments with an organic desiccant. An etched fragment of aluminum or an aluminum alloy and also to a composite material comprising etched fragments.

A method for etching fragments of aluminum or an aluminum alloy comprising the steps of: a. providing a hydrochloric acid solution in a trough-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving an amount of aluminum to produce an etching solution; c. adding the fragments to the etching solution immediately after the inoculation; d. etching the fragments for 0.5 to 10 minutes while stirring in such a way that the fragments are entrained by the motion of the etching solution; e. stopping the etching by diluting the etching solution with water; f. removing the etched fragments; g. repeatedly rinsing the fragments with water and h. rinsing the fragments with an organic desiccant. An etched fragment of aluminum or an aluminum alloy and also to a composite material comprising etched fragments.

A method for processing a raw workpiece into a final workpiece is described, wherein the raw workpiece includes a metallic structure including silicon particles dispersed therein. The raw workpiece is fabricated employing an additive manufacturing process, in one embodiment. The method includes heat-treating the raw workpiece to produce an intermediate workpiece, wherein the heat-treating includes subjecting the raw workpiece to a first temperature environment for a time period to produce an intermediate workpiece to form agglomerated silicon particles, wherein the agglomerated silicon particles are disposed on a surface of the raw workpiece. The method further includes removing the agglomerated silicon particles that are disposed on the surface of the intermediate workpiece.

A method for processing a raw workpiece into a final workpiece is described, wherein the raw workpiece includes a metallic structure including silicon particles dispersed therein. The raw workpiece is fabricated employing an additive manufacturing process, in one embodiment. The method includes heat-treating the raw workpiece to produce an intermediate workpiece, wherein the heat-treating includes subjecting the raw workpiece to a first temperature environment for a time period to produce an intermediate workpiece to form agglomerated silicon particles, wherein the agglomerated silicon particles are disposed on a surface of the raw workpiece. The method further includes removing the agglomerated silicon particles that are disposed on the surface of the intermediate workpiece.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

Porous solid materials are provided. The porous solid materials include a plurality of interconnected wires forming an ordered network. The porous solid materials may have a predetermined volumetric surface area ranging between 2 m.sup.2/cm.sup.3 and 90 m.sup.2/cm.sup.3, a predetermined porosity ranging between 3% and 90% and an electrical conductivity higher than 100 S/cm. The porous solid materials may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 72 m.sup.2/cm.sup.3, a predetermined porosity ranging between 80% and 95% and an electrical conductivity higher than 100 S/cm. The porous solid materials (100) may have a predetermined volumetric surface area ranging between 3 m.sup.2/cm.sup.3 and 85 m.sup.2/cm.sup.3, a predetermined porosity ranging between 65% and 90% and an electrical conductivity higher than 2000 S/cm. Methods for the fabrication of such porous solid materials and devices including such porous solid material are also disclosed.

The present invention relates to a process for the production of an aluminium multilayer brazing sheet which comprises a core layer made of a 3xxx alloy comprising 0.1 to 0.25 wt. % Mg, a brazing layer made of a 4xxx alloy on one or both sides of the core layer, and optionally an interlayer between the core layer and the brazing layer on one or both sides of the core layer, the process comprising the successive steps of: providing the layers to be assembled or simultaneous casting of the layers to obtain a sandwich; rolling of the resulting sandwich to obtain a sheet; and treating the surface of the sheet with an alkaline or acidic etchant.

Provided is a method for treating a surface of an aluminum article capable of imparting an effective anchoring effect to a surface of the aluminum article and enabling a strong chemical bond between the surface of the aluminum article and an organic material layer such as a coated resin layer or a laminated FRP applied to the surface without using a chemical solution that is not easy to treat. In the method for treating a surface of an aluminum article according to the present invention, the surface of the aluminum article is subjected to at least one of an etching treatment, a boehmite treatment, and a zirconium treatment, and then further subjected to at least one of a silane coupling agent treatment, an isocyanate compound treatment, and a thiol compound treatment.