An alkaline cupric chloride etchant for a printed circuit board, comprising copper chloride and a sub-etchant. The sub-etchant comprises the following in percentage by weight: 10 to 30 percent of ammonium chloride, 0.0002 to 25 percent of carboxylic acid and/or ammonium carboxylate, 0.01 to 45 percent of ammonium carbonate and/or ammonium bicarbonate, 0.0001 to 20 percent of one or more selected from hydroxylamine hydrochloride, hydroxylamine sulphate and hydrazine hydrate, the balance being water. The initial feed amount B of copper chloride is calculated according to the following formula: B=(134.5/63.5)x the set value of the copper ion concentration A; the control parameter of the production process of the resulting etchant is set to be: the copper ion concentration of 30-170 g/L.

An alkaline cupric chloride etchant for a printed circuit board, comprising copper chloride and a sub-etchant. The sub-etchant comprises the following in percentage by weight: 10 to 30 percent of ammonium chloride, 0.0002 to 25 percent of carboxylic acid and/or ammonium carboxylate, 0.01 to 45 percent of ammonium carbonate and/or ammonium bicarbonate, 0.0001 to 20 percent of one or more selected from hydroxylamine hydrochloride, hydroxylamine sulphate and hydrazine hydrate, the balance being water. The initial feed amount B of copper chloride is calculated according to the following formula: B=(134.5/63.5)x the set value of the copper ion concentration A; the control parameter of the production process of the resulting etchant is set to be: the copper ion concentration of 30-170 g/L.

The present invention provides a chemical liquid that causes a small variation in a dissolving amount of a first metal-containing substance in a case where the chemical liquid is applied to an object to be treated containing the first metal-containing substance. The present invention also provides a method for treating an object to be treated. The chemical liquid according to an embodiment of the present invention contains water, a hydroxylamine compound selected from the group consisting of hydroxylamine and a hydroxylamine salt, and a specific compound represented by Formula (1).

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The present invention provides a chemical liquid that causes a small variation in a dissolving amount of a first metal-containing substance in a case where the chemical liquid is applied to an object to be treated containing the first metal-containing substance. The present invention also provides a method for treating an object to be treated. The chemical liquid according to an embodiment of the present invention contains water, a hydroxylamine compound selected from the group consisting of hydroxylamine and a hydroxylamine salt, and a specific compound represented by Formula (1).

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The present invention relates to continuous etching system for copper etching in manufacturing of Printed Circuit Boards (PCB). The present invention more particularly relates to continuous etching system provides zero undercut, zero residue copper and non-corrosive surfaces on PCB with environmentally safe and efficient manner. The present invention provides continuous copper etching system in manufacturing of PCBs without pump or any machine force for flowing of etchant.

The present invention relates to continuous etching system for copper etching in manufacturing of Printed Circuit Boards (PCB). The present invention more particularly relates to continuous etching system provides zero undercut, zero residue copper and non-corrosive surfaces on PCB with environmentally safe and efficient manner. The present invention provides continuous copper etching system in manufacturing of PCBs without pump or any machine force for flowing of etchant.

A high-efficiency and environmental-friendly alkaline cupric chloride etchant for a printed circuit board, comprising copper chloride and a sub-etchant. The sub-etchant comprises the following in percentage by weight: 10 to 30 percent of ammonium chloride, 0.0002 to 25 percent of carboxylic acid and/or ammonium carboxylate, 0.01 to 45 percent of ammonium carbonate and/or ammonium bicarbonate, 0.0001 to 20 percent of one or more selected from hydroxylamine hydrochloride, hydroxylamine sulphate and hydrazine hydrate, the balance being water. The initial feed amount B of copper chloride is calculated according to the following formula: B=(134.5/63.5)×the set value of the copper ion concentration A; the control parameter of the production process of the resulting etchant is set to be: the copper ion concentration of 30-170 g/L.

A high-efficiency and environmental-friendly alkaline cupric chloride etchant for a printed circuit board, comprising copper chloride and a sub-etchant. The sub-etchant comprises the following in percentage by weight: 10 to 30 percent of ammonium chloride, 0.0002 to 25 percent of carboxylic acid and/or ammonium carboxylate, 0.01 to 45 percent of ammonium carbonate and/or ammonium bicarbonate, 0.0001 to 20 percent of one or more selected from hydroxylamine hydrochloride, hydroxylamine sulphate and hydrazine hydrate, the balance being water. The initial feed amount B of copper chloride is calculated according to the following formula: B=(134.5/63.5)×the set value of the copper ion concentration A; the control parameter of the production process of the resulting etchant is set to be: the copper ion concentration of 30-170 g/L.

A negative electrode for a lithium secondary battery including a lithium metal layer and a protective layer including a three-dimensional structural body made of metal and lithium nitride on the lithium metal layer. The protective layer induces uniform ionic conductivity and electrical conductivity on the surface of the negative electrode. A method for manufacturing method a negative electrode for a lithium secondary battery including the steps of forming a metal hydroxide having a three-dimensional structure, forming a metal nitride having a three-dimensional structure by a nitridation reaction of the metal hydroxide of the three-dimensional structure; and transferring the metal nitride having the three-dimensional structure onto a lithium metal layer to form a protective layer. A lithium secondary battery including the negative electrode for a lithium secondary battery.

A method for preparing an icephobic surface includes cleaning, etching and anodizing a target surface and applying fluorinated nanoparticles to the cleaned, etched and anodized target surface. A surface is treated according to this method.