Provided are conducting members for fuel cells obtained by applying a protective film forming agent to a surface-treated base material having a base material and at least one alloy plating layer formed on the base material in order to form a protective film on the alloy plating layer, and thereafter subjecting the surface-treated base material to an acid treatment. In the conducting members for fuel cells of the present invention, the protective film forming agent preferably contains a mixture of a compound having a thiol group and an azole-based compound, and/or an azole-based compound having a thiol group. In the conducting members for fuel cells of the present invention, the acid treatment is preferably a treatment using sulfuric acid or nitric acid.

The present invention provides a pigment/additive comprising discrete multivalent oxidation state (DiMVO) phenothiazine compounds having corrosion inhibiting properties. These novel DiMVO phenothiazines are useful in preparing waterborne primer coating formulations for application to metals and metal alloys and demonstrating corrosion inhibiting properties. Furthermore, such formulations are chromate-free and have reduced VOC content. Methods of preparing and using such compounds and waterborne formulations also are described.

The present disclosure is directed to the agents, compositions, and methods for inhibiting corrosion in various substrates, for example in metal substrates. The compositions for inhibiting corrosion comprise at least one organic heterocyclic compound and at least one metal salt or mixed metal salt selected from rare earth, alkali earth and transition metals.

An article includes a substrate; a first corrosion protection layer disposed on the substrate; and a second corrosion protection layer disposed on the first corrosion protection layer. The first corrosion protection layer includes a sol-gel composition and the second corrosion protection layer includes a polyurethane composition. At least one of the first or second corrosion protection layers include a corrosion inhibitor.

A corrosion inhibiting composition includes a first plurality of carriers and a second plurality of carriers. The first plurality of carriers has a first carrier body which encapsulates a film-forming compound. The second plurality of carriers has a second carrier body encapsulates a corrosion inhibitor. Each of the first and second carrier bodies is formed of a degradable material. Coatings and methods for inhibiting corrosion on a metal substrate are also described herein.

The present invention describes novel coolant concentrates and the production and use thereof.

Compositions are described for protecting a metal surface against corrosion. The composition includes a corrosion-inhibiting particle. The corrosion inhibiting particle may be usable in an epoxy resin-based coating or an olefin resin-based coating. The particle may include a core and a protectant. The core may include a water soluble corrosion inhibitor. The protectant may be disposed on at least a portion of a surface of the core and may be covalently or ionically bonded to a thiol group of the corrosion inhibitor. The protectant may be configured to reduce reaction between the core and the epoxy resin or the olefin resin. Methods of making the compositions are also disclosed.

A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.

An electrical connection structure includes: a first metal member including copper or a copper alloy, a plated tin layer being formed on at least a portion of the first metal member; a second metal member that is electrically connected or connectable to the first metal member; and a surface treating layer formed on the surface of the first metal member. The surface treating layer is formed by applying a surface treating agent containing base oil and a metal affinity compound having a lipophilic group and an affinity group that has an affinity for metal. The metal affinity compound contains an adduct between an acidic alkyl phosphate ester and an azole compound and an adduct between an acidic alkyl phosphate ester and a metal and/or an organic amine compound.

A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.