In a method, an aluminum body is chemically treated with at least one of an alkaline solution and an acid solution. Anode-oxidization is performed on the chemically treated aluminum body to form an aluminum oxide layer. The aluminum oxide layer is treated with hot water at a temperature more than 75° C. or steam. The aluminum oxide layer after being treated with hot water or steam includes plural columnar grains, and an average width of the columnar grains is in a range from 10 nm to 100 nm.

A method and apparatus for processing an object (4), for example an aluminium aircraft part, the method comprising: performing a first conversion coating process to dispose a first conversion coating (10) onto at least part of a surface of the object (4); partially masking the first conversion coating (10) disposed on the object (4); performing an etching process to remove, from the object (4), an unmasked portion of the first conversion coating (10) while retaining the masked portion of the first conversion coating (10) on the object (4); and performing a second conversion coating process to dispose a second conversion coating (12) onto a region of the surface of the object (4) from which the unmasked portion of the first conversion coating (10) was removed. A paint layer (14) may then be applied to, e.g., the second conversion coating (12).

A method and apparatus for processing an object (4), for example an aluminium aircraft part, the method comprising: performing a first conversion coating process to dispose a first conversion coating (10) onto at least part of a surface of the object (4); partially masking the first conversion coating (10) disposed on the object (4); performing an etching process to remove, from the object (4), an unmasked portion of the first conversion coating (10) while retaining the masked portion of the first conversion coating (10) on the object (4); and performing a second conversion coating process to dispose a second conversion coating (12) onto a region of the surface of the object (4) from which the unmasked portion of the first conversion coating (10) was removed. A paint layer (14) may then be applied to, e.g., the second conversion coating (12).

The present invention provides: an aluminum alloy member which can be manufactured at a relatively low cost and has a light weight, and which can have high dimensional accuracy under a high-temperature environment and is less likely to undergo the color-fading of a blackened surface even under a high-temperature environment, and has excellent heat resistance; and a method for manufacturing the aluminum alloy member with high efficiency. The aluminum alloy member according to the present invention comprises: a substrate which comprises an extruded material of an aluminum powder alloy having an Si content of 20 to 40% by mass and has an anodic oxide coating film formed on the surface thereof, and an electrolytically colored layer which is formed by precipitating a metal or a metal salt on voids in the anodic oxide coating film.

A method of preparing an aluminum alloy resin composite comprises: providing an aluminum alloy substrate having an oxide layer on a surface thereof, wherein the oxide layer has one or more nanopores; forming one or more corrosion pores on an outer surface of the oxide layer by using a corrosion agent, wherein the corrosion agent is at least one selected from a group of ammonia, ammonium salt, hydrazine, hydrazine derivative, and water-soluble amine compound; and injection molding a resin composition to the surface of the aluminum alloy substrate.

A method of preparing an aluminum alloy resin composite comprises: providing an aluminum alloy substrate having an oxide layer on a surface thereof, wherein the oxide layer has one or more nanopores; forming one or more corrosion pores on an outer surface of the oxide layer by using a corrosion agent, wherein the corrosion agent is at least one selected from a group of ammonia, ammonium salt, hydrazine, hydrazine derivative, and water-soluble amine compound; and injection molding a resin composition to the surface of the aluminum alloy substrate.

A material, such as a flexible sheet, including a metal or metal alloy, wherein the metal or metal alloy has at least one porous metal oxide layer thereon. In some examples, the at least one metal oxide layer has a three-dimensional disordered network of channels in which the pores have non-constant diameters. Methods of preparing the materials are also disclosed.

A method for manufacturing a mold includes (a) anodizing an aluminum substrate at a voltage of 60 V to 120 V in an electrolytic solution in which two or more species of acid are mixed, and forming an oxide film having a plurality of minute holes on a surface of the aluminum substrate; and (b) removing at least a portion of the oxide film. The electrolytic solution used in (a) satisfies the relation (D1)/2<D2, where D1 is the current density when the aluminum substrate is anodized under the same conditions as in (a) in an electrolytic solution of only the acid (A) having the highest acid dissociation constant (Ka) of the two or more species of acid, and D2 is the current density when the aluminum substrate is anodized under the same conditions (a) in the same electrolytic solution as that of (a).

A method for manufacturing a mold includes (a) anodizing an aluminum substrate at a voltage of 60 V to 120 V in an electrolytic solution in which two or more species of acid are mixed, and forming an oxide film having a plurality of minute holes on a surface of the aluminum substrate; and (b) removing at least a portion of the oxide film. The electrolytic solution used in (a) satisfies the relation (D1)/2<D2, where D1 is the current density when the aluminum substrate is anodized under the same conditions as in (a) in an electrolytic solution of only the acid (A) having the highest acid dissociation constant (Ka) of the two or more species of acid, and D2 is the current density when the aluminum substrate is anodized under the same conditions (a) in the same electrolytic solution as that of (a).

The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.