Patent classifications
C25D11/10
Nano-porous anodic aluminum oxide membrane for healthcare and biotechnology
A method of manufacturing a nano-structured aluminum oxide film. The first step involves degreasing an aluminum plate using a degreasing solution. The next step involves electropolishing the aluminum plate after degreasing with an electropolishing solution that is free of perchloric acid and chromic acid. The next step involves pre-anodizing the aluminum plate after electropolishing with an anodization acid solution for a first predetermined time period. The next step involves anodizing the aluminum plate after electropolishing with the anodization acid solution for a second predetermined time period to form an anodized membrane on the aluminum plate. The next step involves separating the anodized membrane from the aluminum plate with a solution free of chrome. The last step involves cleaning the anodized membrane.
Etching for bonding polymer material to a metal surface
This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.
Etching for bonding polymer material to a metal surface
This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.
METHOD FOR ALUMINUM ELECTROLESS DEPOSITION
A method for electroless deposition of aluminum or an aluminum alloy on a substrate surface. The method includes activating the surface of the substrate to be coated by applying a coating of a catalyst metal; preparing a mixture of urea ((NH.sub.2CONH.sub.2) and anhydrous aluminum chloride (AlCl.sub.3) wherein a molar ratio of AlCl.sub.3:(NH.sub.2CONH.sub.2 is greater than 1:1 to obtain a Lewis acid room temperature ionic liquid (RTIL) optionally containing an alloy metal salt; dissolving a hydride reducing agent in an aprotic anhydrous solvent to obtain a hydride solution; mixing the hydride solution and the AlCl.sub.3:(NH.sub.2CONH.sub.2 RTIL to obtain an electroless Al solution; exposing the activated surface of the substrate to the electroless Al solution; and removing the electroless Al solution from the substrate surface; wherein upon exposure of the activated substrate surface to the electroless Al solution, an Al or Al alloy coating is obtained on the activated substrate surface.
METHOD AND COMPOSITION FOR SELECTIVE ANODIZATION
A composition for selective anodization, comprising the substances amidosulphuric acid, magnesium sulphate and concentrated sulphuric acid as a base electrolyte and additionally sodium stannate and/or molybdenum oxide. A corresponding method of selectively anodizing a substrate or workpiece includes providing a substrate having a surface which is to be selectively coated, where the substrate is arranged in a tool and forms a coating cell, selectively bathing the surface with the composition for selective anodization, and applying an electric current between substrate (anode) and tool (cathode) for selective anodization of the surface.
TREATED ANODIZED METAL ARTICLE AND METHOD OF MAKING
A method is disclosed for treating an anodized metal surface. According to the method, polynuclear clusters comprising aluminum oxide hydroxide are applied to the anodized metal surface.
Aluminum-based coating for flat steel products for press mold hardening components, and method for producing same
An aluminum-based coating of a flat steel product is applied in a hot-dipping method and comprises a mass percentage of silicon within a given range. The coating for a flat steel product, in particular for press mold hardening components, offers a shortened required minimum oven dwell time and a sufficiently large processing window when heating in an oven. This is achieved in that the surface of the coating has a degree of absorption for thermal radiation ranging between 0.35 and 0.95 prior to an annealing treatment, where the degree of absorption relates to an oven temperature ranging from 880 to 950° C. during the austenitizing annealing treatment. The invention additionally relates to an improved method for producing a flat steel product with an aluminum-based coating, to an inexpensive method for producing press-hardened components from such flat steel products, and to a press-hardened component made of such flat steel products.
METHOD OF PATTERNING A LAYER OF SUPERCONDUCTOR MATERIAL
A method of patterning a layer of superconductor material comprises: forming a mask over the layer of superconductor material, the mask having at least one opening; depositing a layer of anodizable metal in the at least one opening, over a portion of the layer of superconductor material; removing the mask; and performing anodic oxidation, whereby the layer of anodizable metal protects the portion of the layer of the superconductor material from the anodic oxidation. The superconductor material is aluminium. The method allows for patterning of the superconductor material without the use of a chemical etch. This may in turn allow for improvements in resolution, and/or may avoid damage to further components or interfaces between components which may be present during the patterning. Also provided are the use of a titanium layer to protect an aluminium layer from anodic oxidation, and a semiconductor-superconductor hybrid device obtainable by the method.
METHOD OF PATTERNING A LAYER OF SUPERCONDUCTOR MATERIAL
A method of patterning a layer of superconductor material comprises: forming a mask over the layer of superconductor material, the mask having at least one opening; depositing a layer of anodizable metal in the at least one opening, over a portion of the layer of superconductor material; removing the mask; and performing anodic oxidation, whereby the layer of anodizable metal protects the portion of the layer of the superconductor material from the anodic oxidation. The superconductor material is aluminium. The method allows for patterning of the superconductor material without the use of a chemical etch. This may in turn allow for improvements in resolution, and/or may avoid damage to further components or interfaces between components which may be present during the patterning. Also provided are the use of a titanium layer to protect an aluminium layer from anodic oxidation, and a semiconductor-superconductor hybrid device obtainable by the method.
Transforming a valve metal layer into a template comprising a plurality of spaced (nano)channels and forming spaced structures therein
At least one embodiment relates to a method for transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. The method includes a first anodization step that includes anodizing the valve metal layer in a thickness direction to form a porous layer that includes a plurality of channels. Each channel has channel walls and a channel bottom. The channel bottom is coated with a first insulating metal oxide barrier layer as a result of the first anodization step. The method also includes a protective treatment. Further, the method includes a second anodization step after the protective treatment. The second anodization step substantially removes the first insulating metal oxide barrier layer, induces anodization, and creates a second insulating metal oxide barrier layer. In addition, the method includes an etching step.