Patent classifications
C25D11/20
Methods of modifying the porous surface of implants
Methods are provided for modifying a porous surface of an implantable medical device by subjecting the porous surface to a modified micro-arc oxidation process to improve the ability of the medical device to resist microbial growth, to improve the ability of the medical device to adsorb a bioactive agent or a therapeutic agent, and to improve tissue in-growth and tissue on-growth of the implantable medical device.
REDUCING VARIANCE IN CAPACITOR ELECTRODES
Fabricating an electrode for capacitor includes performing a first set of one or more preliminary oxide formation operations on a sheet of material. The method also includes performing a capacitance test on the sheet of material so as to determine the capacitance of the sheet of material after the one or more preliminary oxide formation operations. The method proceeds on a first path in response to a first result of the capacitance test and on a second path in response to a second result of the capacitance test. The first path includes performing a second set of the one or more preliminary oxide formation operations on the sheet of material so as to reduce the capacitance of the sheet of material below the determined capacitance. The second path excludes performing any preliminary oxide formation operations on the sheet of material.
REDUCING VARIANCE IN CAPACITOR ELECTRODES
Fabricating an electrode for capacitor includes performing a first set of one or more preliminary oxide formation operations on a sheet of material. The method also includes performing a capacitance test on the sheet of material so as to determine the capacitance of the sheet of material after the one or more preliminary oxide formation operations. The method proceeds on a first path in response to a first result of the capacitance test and on a second path in response to a second result of the capacitance test. The first path includes performing a second set of the one or more preliminary oxide formation operations on the sheet of material so as to reduce the capacitance of the sheet of material below the determined capacitance. The second path excludes performing any preliminary oxide formation operations on the sheet of material.
METHOD FOR MANUFACTURING STRUCTURE
Provided is a method of manufacturing a structure that can be easily bonded to a bonding target. The method of manufacturing a structure includes: a conductive layer forming step of forming a conductive layer having conductivity on a part of a surface of an insulating support including at least one surface; a valve metal layer forming step of forming a valve metal layer that covers at least a part of the conductive layer; an anodic oxidation film forming step of forming an anodic oxidation film by performing an anodization treatment on the valve metal layer in a region on the conductive layer using the conductive layer as an electrode; a micropore forming step of forming a plurality of micropores that extend in a thickness direction on the anodic oxidation film; and a filling step of filling the micropores with a conductive material, in which a valve metal layer removing step of removing the valve metal layer having undergone the anodic oxidation film forming step is performed between the anodic oxidation film forming step and the filling step.
Furniture lubricant
A furniture lubricant for coating a linear lacquered furniture slide bar to provide a slide layer with lowered friction. The furniture lubricant comprises a C10 to C28 alkane and a tri-glyceride. The viscosity, according to ISO 3104:1994/COR 1:1997, of the furniture lubricant at 40° C. is 20 to 80 mm.sup.2/s.
COVERS FOR ELECTRONIC DEVICES
The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate with an opening therethrough, and a first protective coating covering the light metal substrate. A second protective coating is on the first protective coating, and a chamfered edge is present along the opening where the chamfer cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge. In one example, a transparent passivation layer is included along the chamfered edge.
ANODIZING METHOD AND MANUFACTURING METHOD FOR AN ANISOTROPIC CONDUCTIVE MEMBER
There are provided an anodizing method by which straight micropores can be formed and a manufacturing method for an anisotropic conductive member in which a filling defect of a conductive material is suppressed. The anodizing method is a method including subjecting a surface of a valve metal plate to a plurality of times of anodization and forming an anodized film having micropores present in a thickness direction of the valve metal plate and having a barrier layer present in the bottom part of the micropores, on the surface of the valve metal plate. In steps of second and subsequent times of anodization of the plurality of times of anodization, a current increasing period and a current keeping period are continuous. The current increasing period is a period in which a quantity of current increase is more than 0 amperes per square meter per second and 0.2 amperes per square meter per second or less, and which is 10 minutes or less. A current is kept at a constant value during a current keeping period, and the constant value is equal to or less than a maximum current value during the current increasing period.
ANODIZING METHOD AND MANUFACTURING METHOD FOR AN ANISOTROPIC CONDUCTIVE MEMBER
There are provided an anodizing method by which straight micropores can be formed and a manufacturing method for an anisotropic conductive member in which a filling defect of a conductive material is suppressed. The anodizing method is a method including subjecting a surface of a valve metal plate to a plurality of times of anodization and forming an anodized film having micropores present in a thickness direction of the valve metal plate and having a barrier layer present in the bottom part of the micropores, on the surface of the valve metal plate. In steps of second and subsequent times of anodization of the plurality of times of anodization, a current increasing period and a current keeping period are continuous. The current increasing period is a period in which a quantity of current increase is more than 0 amperes per square meter per second and 0.2 amperes per square meter per second or less, and which is 10 minutes or less. A current is kept at a constant value during a current keeping period, and the constant value is equal to or less than a maximum current value during the current increasing period.
Reducing variance in capacitor electrodes
Fabricating an electrode for capacitor includes performing a first set of one or more preliminary oxide formation operations on a sheet of material. The method also includes performing a capacitance test on the sheet of material so as to determine the capacitance of the sheet of material after the one or more preliminary oxide formation operations. The method proceeds on a first path in response to a first result of the capacitance test and on a second path in response to a second result of the capacitance test. The first path includes performing a second set of the one or more preliminary oxide formation operations on the sheet of material so as to reduce the capacitance of the sheet of material below the determined capacitance. The second path excludes performing any preliminary oxide formation operations on the sheet of material.
Reducing variance in capacitor electrodes
Fabricating an electrode for capacitor includes performing a first set of one or more preliminary oxide formation operations on a sheet of material. The method also includes performing a capacitance test on the sheet of material so as to determine the capacitance of the sheet of material after the one or more preliminary oxide formation operations. The method proceeds on a first path in response to a first result of the capacitance test and on a second path in response to a second result of the capacitance test. The first path includes performing a second set of the one or more preliminary oxide formation operations on the sheet of material so as to reduce the capacitance of the sheet of material below the determined capacitance. The second path excludes performing any preliminary oxide formation operations on the sheet of material.