A film structure comprises a substrate and a buffer film formed on the substrate. The substrate is a 36° to 48° rotated Y-cut Si substrate, or the substrate is a SOI substrate including a base substance made of the 36° to 48° rotated Y-cut Si substrate, an insulating layer on the base substance, and a SOI layer made of a Si film on the insulating layer, and a mirror index of a crystal plane of an upper surface of the SOI layer is equal to a mirror index of a crystal plane of an upper surface of the base substance. The buffer film includes ZrO.sub.2 epitaxially grown on the substrate.

A film structure comprises a substrate and a buffer film formed on the substrate. The substrate is a 36° to 48° rotated Y-cut Si substrate, or the substrate is a SOI substrate including a base substance made of the 36° to 48° rotated Y-cut Si substrate, an insulating layer on the base substance, and a SOI layer made of a Si film on the insulating layer, and a mirror index of a crystal plane of an upper surface of the SOI layer is equal to a mirror index of a crystal plane of an upper surface of the base substance. The buffer film includes ZrO.sub.2 epitaxially grown on the substrate.

Provided is a dielectric thin film including a metal oxide. The metal oxide includes bismuth, sodium, barium, and titanium, at least a part of the metal oxide is a tetragonal crystal having a perovskite structure, and a (100) plane of at least a part of the tetragonal crystal is oriented in a normal direction do of a surface of the dielectric thin film 3.

Growth of single crystals of lead zirconate titanate (PZT) and other perovskites is accomplished by liquid phase epitaxy onto a substrate of suitable structural and lattice parameter match. A solvent and specific growth conditions for stable growth are required to achieve the desired proportions of Zr and Ti.

Growth of single crystals of lead zirconate titanate (PZT) and other perovskites is accomplished by liquid phase epitaxy onto a substrate of suitable structural and lattice parameter match. A solvent and specific growth conditions for stable growth are required to achieve the desired proportions of Zr and Ti.

A method of arranging nanocrystals is provided, which includes a first process of putting barium titanate nanocrystals and/or strontium titanate nanocrystals, and a nonpolar solvent into a container, a second process of collecting a supernatant liquid including the barium titanate nanocrystals and/or the strontium titanate nanocrystals from the container, and a third process of immersing a substrate having an uneven structure into the supernatant liquid, and pulling up the substrate so as to coat the surface of the uneven structure with the supernatant liquid by using a capillary phenomenon, and to arrange the nanocrystals on the uneven structure.

Among other things, piezoelectric materials and methods of their manufacture are described; particularly methods of forming regions of varying crystal structure within a relaxor piezoelectric substrate. Such methods may including heating the piezoelectric substrate above the transition temperature and below the Curie temperature such that a first phase transition occurs to a first crystal structure; rapidly cooling the piezoelectric substrate below the transition temperature at a cooling rate that is sufficiently high for the first crystal structure to persist; and applying an electric field through one or more selected regions of the piezoelectric substrate, such that within the one or more selected regions, a second phase transition occurs and results in a second crystal structure.

Among other things, piezoelectric materials and methods of their manufacture are described; particularly methods of forming regions of varying crystal structure within a relaxor piezoelectric substrate. Such methods may including heating the piezoelectric substrate above the transition temperature and below the Curie temperature such that a first phase transition occurs to a first crystal structure; rapidly cooling the piezoelectric substrate below the transition temperature at a cooling rate that is sufficiently high for the first crystal structure to persist; and applying an electric field through one or more selected regions of the piezoelectric substrate, such that within the one or more selected regions, a second phase transition occurs and results in a second crystal structure.

Various embodiments provide for systems and techniques for the successful fabrication of metal oxide (TMO)-on-glass layer stacks via direct deposition. The resulting samples feature epitaxial, strontium titanate (STO) or barium titanate (BTO) films on silicon dioxide (SiO.sub.2) layers, forming STO- or BTO-buffered SiO.sub.2 pseudo-substrates. As the integration of TMO films on silicon rely on an STO or BTO buffer layer, a wide variety of TMO-based integrated devices (e.g., circuits, waveguides, etc.) can be fabricated from the TMO-on-glass platform of the present technology. Moreover, the STO, or the BTO, survives the fabrication process without a corresponding degradation of crystalline quality, as evidenced by various objective measures.

Various embodiments provide for systems and techniques for the successful fabrication of metal oxide (TMO)-on-glass layer stacks via direct deposition. The resulting samples feature epitaxial, strontium titanate (STO) or barium titanate (BTO) films on silicon dioxide (SiO.sub.2) layers, forming STO- or BTO-buffered SiO.sub.2 pseudo-substrates. As the integration of TMO films on silicon rely on an STO or BTO buffer layer, a wide variety of TMO-based integrated devices (e.g., circuits, waveguides, etc.) can be fabricated from the TMO-on-glass platform of the present technology. Moreover, the STO, or the BTO, survives the fabrication process without a corresponding degradation of crystalline quality, as evidenced by various objective measures.